Enhanced heat transfer in printed circuit boards and electronic components thereof

A circuit board having an enhanced heat transfer capability, comprising:

• (a) a circuit board with electronic components which is at least in part cooled by a gas flowing around the board;
• and,
• (b) a structure for providing an enhanced heat transfer capability, the structure comprising, thermally conductive fibers attached at a first end to at least a portion of some of the exterior surfaces of the circuit board and electronic components thereof, each of said fibers extending out from the exterior surfaces in a generally perpendicular direction so as to transfer heat to the gas.

In a circuit board at least in part cooled by a gas flowing around the board, and having electronic components comprising at least one temperature sensitive electronic component wherein power input to said temperature sensitive electronic component can be increased in proportion to an increase in a rate of heat transfer from the temperature sensitive electronic component to the gas, a method for providing an enhanced heat transfer capability, the method comprising the step of:

• permanently attaching thermally conductive fibers to at least a portion of some of the exterior surfaces of the at least one temperature sensitive electronic component by adhering the thermally conductive fibers to said exterior surfaces using a layer of adhesive, each of said fibers extending out from the at least a portion of some of the exterior surfaces in a generally perpendicular direction so as to transfer heat to the gas.

A circuit board having an enhanced heat transfer capability, comprising:

• (a) a circuit board with electronic components which is at least in part cooled by a gas flowing around the board, and wherein at least one of the electronic components of the circuit board is a temperature sensitive electronic component such that power input to said temperature sensitive electronic component can be increased in proportion to an increase in a rate of heat transfer from the temperature sensitive electronic component to the gas;
• and,
• (b) a structure for providing an enhanced heat transfer capability, the structure comprising thermally conductive carbon fibers permanently attached at a first end to at least a portion of some of the exterior surfaces of the at least one temperature sensitive electronic component, each of said fibers extending out from the at least a portion of some of the exterior surfaces in a generally perpendicular direction so as to transfer heat to the gas.