H05K 7/20418
The radiating structures being additional and fastened onto the housing
Official title: {the radiating structures being additional and fastened onto the housing}
H05K7/20418 (The radiating structures being additional and fastened onto the housing) appears on 420 US grants and 568 published applications in this corpus.
Search patents in H05K- Granted patents
- 420
- Published applications
- 568
- Assignees
- 282
- Inventors
- 1,236
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 7 |
| 2004 | 7 | 4 |
| 2005 | 4 | 5 |
| 2006 | 4 | 6 |
| 2007 | 8 | 13 |
| 2008 | 7 | 12 |
| 2009 | 5 | 9 |
| 2010 | 5 | 10 |
| 2011 | 8 | 17 |
| 2012 | 6 | 10 |
| 2013 | 14 | 23 |
| 2014 | 13 | 19 |
| 2015 | 18 | 25 |
| 2016 | 20 | 24 |
| 2017 | 20 | 30 |
| 2018 | 35 | 34 |
| 2019 | 23 | 27 |
| 2020 | 35 | 35 |
| 2021 | 32 | 45 |
| 2022 | 26 | 33 |
| 2023 | 30 | 47 |
| 2024 | 35 | 46 |
| 2025 | 28 | 45 |
| 2026 | 25 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Connector assembly with improved heat dissipation effect17 Sep 2026US 2026/0280196 A1Dongguan Luxshare Technologies Co., Ltd
- Connection bracket for heat sink, heat sink, and server heat-dissipation system27 Aug 2026US 2026/0251157 A1Lenovo Global Technology (Taiwan) Limited.
Most cited
By later US patents
- Pluggable electronic module and receptacle with heat sink183US 6,816,376 B2Tyco Electronics Corporation · 2004
- Transceiver and interface for IC package105US 8,588,561 B2Samtec, Inc. · 2013
- Transceiver module assembly ejector mechanism91US 6,749,448 B2Tyco Electronics Corporation · 2004
- Transceiver and interface for IC package89US 8,787,711 B2Samtec, Inc. · 2014
- Pluggable electronic receptacle with heat sink assembly76US 6,980,437 B2Tyco Electronics Corporation · 2005