Device and method for dissipating heat from an electronic component of a motor vehicle

A device for dissipating heat from an electronic component of a motor vehicle, comprising:

• at least one cooler having at least one connection face, wherein the connection face is configured such that the electronic component arranged on a circuit board may be cooled via the connection face;
• and
• at least one housing which at least partially encloses the circuit board, wherein the housing has at least one housing opening, wherein at least a portion of the cooler extends out of the housing opening, wherein a gap dimension between the electronic component and the connection face is configured to be adjustable in different steps via at least one stepped arrangement.

The device according to 15, wherein following adjustment of the gap dimension, at least one connector is provided for fixing the cooler relative to the electronic component, wherein the connector effects a fixation compensating for the relative movement and interacts with an oversized hole or elongated hole.