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AssigneeCray Research, Inc.
InventorsRichard B. Salmonson, Daniel John Dravis
Estimating the term…
A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.
A method of cooling a plurality of electronic elements including a first electronic element mounted on a printed circuit board assembly, the method comprising the steps of:
A computer circuit module comprising:
Dependencies are inferred from the claim text.