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AssigneeLaird Technologies, Inc.
InventorsJason L. STRADER, John N. HODUL
Estimating the term…
Disclosed are exemplary methods for forming three-dimensional (3D) thermal joints using thermal interface materials (TIMs), e.g., low melting alloys, liquid metals, rheology controlled TIMs, metal amalgams (e.g., metal amalgam (non-mercury), combination of two or more metals without mercury, etc.), etc. Also disclosed are exemplary embodiments of three-dimensional (3D) thermal joints including TIMs, e.g., low melting alloys, liquid metals, rheology controlled TIMs, metal amalgams, etc. The 3D thermal joint may be used to fill in gap(s) between a heat source(s) and another component(s) of an electronic device. For example, the 3D thermal joint may be used to fill in the gaps between multiple heat sources of varying heights (e.g., integrated circuit (IC) components of varying heights, 2D processor, 2.5D processor, 3D processor, chiplet segmented processor, other component(s) having multiple heights, etc.) and a heat removal/dissipation component (e.g., heat sink, heat spreader, heat pipe, vapor chamber, water block, device housing, etc.).
-20. (canceled)
A method comprising using a thermal interface material to form a three-dimensional thermal joint filling multiple gaps of different distances between first and second thermal transfer surfaces of an electronic device such that heat is flowable through the three-dimensional thermal joint between the first and second thermal transfer surfaces, whereby the three-dimensional thermal joint formed by the thermal interface material is three-dimensionally shaped with multiple different heights as determined by the multiple gaps being filled by the thermal interface material between the first and second thermal transfer surfaces of the electronic device.
A three-dimensional thermal joint comprising a thermal interface material configured for filling multiple gaps of different distances between first and second thermal transfer surfaces of an electronic device such that heat is flowable through the three-dimensional thermal joint between the first and second thermal transfer surfaces, whereby the three-dimensional thermal joint formed by the thermal interface material is three-dimensionally shaped with multiple different heights as determined by the multiple gaps being filled by the thermal interface material between the first and second thermal transfer surfaces of the electronic device.
Dependencies are inferred from the claim text.