Systems structures and materials for electronic device cooling
AssigneeOutlast Technologies, Inc.
InventorsMark Hartmann, Greg Roda
Life of this patent
Estimating the term…
Abstract
An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.
Claims21
An electronic device, wherein one or more components of the electronic device generate heat during operation, the electronic device including structure for temperature management and heat dissipation, the structure for temperature management and heat dissipation comprising:
- a heat transfer substrate having a surface that is in thermal communication with an ambient environment;
- a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate;
- the temperature management material comprising,
- a mixture of two or more crosslinked polymeric latent heat storage materials, the mixture having two different transition temperatures between 0° C. and 100° C.;
- and
- a thermal conductive filler.
A personal computing device, comprising:
- a housing;
- a printed circuit board;
- one or more components attached to the printed circuit board that generate heat during operation of the electronic device;
- structure for temperature management and heat dissipation, the structure for temperature management and heat dissipation comprising:
- a heat transfer substrate having a surface that is in thermal communication with the printed circuit board and a surface that is in thermal communication with an ambient environment;
- a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate;
- the temperature management material comprising,
- a mixture of two or more polymeric latent heat storage materials the mixture having two different transition temperatures between 0° C. and 100° C.;
- and
- a thermal conductive filler.
A method of constructing a personal computing device, the personal computing device comprising a housing, a printed circuit board, one or more components attached to the printed circuit board that generate heat during operation of the electronic device, and a structure for temperature management and heat dissipation, the structure for temperature management and heat dissipation comprising a heat transfer substrate having a surface that is in thermal communication with the printed circuit board and a surface that is in thermal communication with an ambient environment, a mixture of two or more temperature management materials, the mixture in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate, at least one of the two temperature management materials comprising, a functional polymeric latent heat storage material, carrying at least one function, having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler, the method comprising:
- applying the mixture over at least a portion of the one or more components attached to the printed circuit board;
- enclosing the printed circuit board, the one or more components, and the structure for temperature management and heat dissipation with the housing;
- curing the mixture.
An electronic device, wherein one or more components of the electronic device generate heat during operation, the electronic device including structure for temperature management and heat dissipation, the structure for temperature management and heat dissipation comprising:
- a heat transfer substrate having a surface that is in thermal communication with an ambient environment;
- a mixture of two or more temperature management materials, the mixture in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate;
- at least one of the temperature management materials comprising,
- a crosslinked polymeric latent heat storage material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C. and carrying at least one function;
- and
- a thermal conductive filler.
Dependencies are inferred from the claim text.