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AssigneeInternational Business Machines Corporation
InventorsDavid L. Edwards, Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo
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The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.
A process for providing heat transfer to at least one chip, comprising the step of placing a thermal paste preform on said at least one chip to provide said heat transfer, wherein prior to said step of placing said thermal paste preform is subcooled to a subcooling temperature so that said thermal paste preform is temporarily stiffened.
Dependencies are inferred from the claim text.