Thermal management system including an overmolded layer and a conductive layer over a circuit board

A system, comprising:

• an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board, wherein the overmolded layer exposes a surface of the heat generating component;
• and
• a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board, wherein the conductive layer comprises a recessed area over the surface of the heat generating component on the circuit board, and wherein heat from the heat generating component is transferred into the conductive layer.