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US 12,684,736 B2Granted
Integration of systems comprising standard electronic components in satellites
AssigneeUnseenlabs
InventorsJonathan Galic, Marc Grieu
Life of this patent
Estimating the term…
Abstract
A system includes a sealed enclosure comprising: an outer layer comprising a metallic foam; a radiation shielding layer; one or more heat transfer elements comprising one or more active heat transfer element disposed on one or more inner faces of the sealed enclosure, and configured or configurable to extract heat from the interior of the sealed enclosure; one or more electronic related components inside the sealed enclosure.
Claims13
A spacecraft comprising a system comprising a sealed enclosure (Enc), the sealed enclosure comprising:
- an inner layer (Lay23) configured to maintain a pressure difference between the inside and the outside of the sealed enclosure (Enc);
- an outer layer (Lay21) comprising a metallic foam;
- a radiation shielding layer (Lay22);
- one or more heat transfer elements (HT21, HT22, HT23, HT3, HT41, HT42, HT43) comprising one or more active heat transfer element disposed on one or more inner faces of the sealed enclosure, and configured or configurable to extract heat from the interior of the sealed enclosure;
- and
- one or more electronic related components (El3, El41, El42, El43) inside the sealed enclosure.
3 more elements
Dependencies are inferred from the claim text.