H05K 7/2029
Using a liquid coolant with phase change in electronic enclosures
Official title: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}
H05K7/2029 (Using a liquid coolant with phase change in electronic enclosures) appears on 2,454 US grants and 3,656 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,454
- Published applications
- 3,656
- Assignees
- 998
- Inventors
- 5,786
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 16 | 0 |
| 2000 | 25 | 0 |
| 2001 | 17 | 5 |
| 2002 | 21 | 15 |
| 2003 | 22 | 19 |
| 2004 | 12 | 15 |
| 2005 | 11 | 20 |
| 2006 | 15 | 14 |
| 2007 | 11 | 20 |
| 2008 | 8 | 10 |
| 2009 | 9 | 17 |
| 2010 | 9 | 28 |
| 2011 | 18 | 40 |
| 2012 | 16 | 37 |
| 2013 | 20 | 66 |
| 2014 | 33 | 109 |
| 2015 | 66 | 110 |
| 2016 | 94 | 104 |
| 2017 | 82 | 168 |
| 2018 | 124 | 152 |
| 2019 | 160 | 224 |
| 2020 | 199 | 291 |
| 2021 | 198 | 261 |
| 2022 | 179 | 329 |
| 2023 | 232 | 408 |
| 2024 | 277 | 351 |
| 2025 | 345 | 399 |
| 2026 | 174 | 444 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Immersion cooling system implementing a first container and a second container6 Oct 2026US 12,757,351 B2Ovh
- Immersion cooling system6 Oct 2026US 12,757,352 B2Wiwynn Corporation
- Heat exchanger module for immersion cooling system6 Oct 2026US 12,757,353 B2Man Zai Industrial Co., Ltd.
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Main body sheet for vapor chamber, vapor chamber, and electronic apparatus6 Oct 2026US 12,757,355 B2Dai Nippon Printing Co.Ltd.
- Antenna structure and electronic device8 Oct 2026US 2026/0312281 A1Wistron Neweb Corp.
- Microfluidic printed circuit board cooling8 Oct 2026US 2026/0313782 A1Microsoft Technology Licensing, LLC
- Electronic Circuit Board and Immersion Cooling Apparatus for the Same8 Oct 2026US 2026/0313839 A1SK Innovation Co., Ltd.
- Host system with a liquid detector8 Oct 2026US 2026/0313840 A1Aivres Systems Inc.
- System for cooling a data center using evaporation heat of lng liquid gas8 Oct 2026US 2026/0313841 A1
Most cited
By later US patents
- Packaging system for thermally controlling the temperature of electronic equipment182US 6,104,611 ANortel Networks Limited · 2000
- Large area, multi-device heat pipe for stacked MCM-based systems163US 6,055,157 ACray Research, Inc. · 2000
- Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling143US 8,014,150 B2International Business Machines Corporation · 2011
- Liquid cooling system for LSI packages137US 5,522,452 ANEC Corporation · 1996
- Heat spreader system for cooling heat generating components137US 5,943,211 ARaytheon Company · 1999