H05K 7/20336
Heat pipes
Official title: {Heat pipes, e.g. wicks or capillary pumps}
H05K7/20336 (Heat pipes) appears on 1,073 US grants and 1,637 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,073
- Published applications
- 1,637
- Assignees
- 530
- Inventors
- 3,118
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 4 |
| 2003 | 4 | 2 |
| 2004 | 2 | 5 |
| 2005 | 2 | 8 |
| 2006 | 7 | 4 |
| 2007 | 3 | 6 |
| 2008 | 3 | 2 |
| 2009 | 2 | 9 |
| 2010 | 6 | 11 |
| 2011 | 5 | 17 |
| 2012 | 6 | 18 |
| 2013 | 9 | 27 |
| 2014 | 15 | 44 |
| 2015 | 25 | 56 |
| 2016 | 48 | 51 |
| 2017 | 36 | 89 |
| 2018 | 63 | 81 |
| 2019 | 83 | 131 |
| 2020 | 114 | 173 |
| 2021 | 111 | 129 |
| 2022 | 86 | 154 |
| 2023 | 97 | 173 |
| 2024 | 108 | 126 |
| 2025 | 146 | 171 |
| 2026 | 68 | 146 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Main body sheet for vapor chamber, vapor chamber, and electronic apparatus6 Oct 2026US 12,757,355 B2Dai Nippon Printing Co.Ltd.
- Electronic device including thermal diffusion member29 Sep 2026US 12,750,976 B2Samsung Electronics Co., Ltd.
- Electronic device including thermal diffusion member29 Sep 2026US 12,750,977 B2Samsung Electronics Co., Ltd.
- Vapor chamber with dynamically adjustable local evaporative resistance15 Sep 2026US 12,740,017 B2Intel Corporation
- Antenna structure and electronic device8 Oct 2026US 2026/0312281 A1Wistron Neweb Corp.
- Electronic device including vapor chamber8 Oct 2026US 2026/0313843 A1Samsung Electronics Co., Ltd.
- Heat sink structure and methods thereof8 Oct 2026US 2026/0313844 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Vertical power supply assembly and smart card assembly with integrated heat sink1 Oct 2026US 2026/0299657 A1MetaPWR Electronics Co., Ltd.
- A heat exchanger for an electronic component of a server1 Oct 2026US 2026/0304698 A1Y.E. Hub Armenia LLC
Most cited
By later US patents
- Packaging system for thermally controlling the temperature of electronic equipment182US 6,104,611 ANortel Networks Limited · 2000
- Large area, multi-device heat pipe for stacked MCM-based systems163US 6,055,157 ACray Research, Inc. · 2000
- Devices using a medium having a high heat transfer rate103US 7,220,365 B2New Qu Energy Ltd. · 2007
- High performance cold plate96US 6,411,512 B1Delta Engineers · 2002
- Integrated heat pipe and circuit board structure94US 5,283,715 AInternational Business Machines Corporation · 1994