Integrated heat pipe and circuit board structure

A metal-backed printed circuit board with electronic components mounted thereon for use in electronic circuits such as power supplies, comprising:

• a metallic flat baseplate for said printed circuit board;
• a flat heat pipe structure including a frame incorporated into direct contact with said baseplate thereby forming an integral circuit board and heat pipe assembly, said heat pipe structure comprised of a plurality of separate linear heat pipes packed side by side in direct physical contact each said heat pipe, having therein an encapsulated working fluid said assembly having an evaporator portion upon which said components are mounted and a cooling portion separate from said evaporator portion, said cooling portion for attachment to a cooling structure, said baseplate and said heat pipe structure extending throughout said evaporator portion and said cooling portion whereby heat generated in said evaporator portion vaporizes said working fluid to move the vaporized fluid through said heat pipe to said cooling portion, where said fluid is returned to a liquid state to move by capillary action through said heat pipe back to said evaporator portion.