H05K 7/20363
Refrigerating circuit comprising a sorber
Official title: {Refrigerating circuit comprising a sorber}
H05K7/20363 (Refrigerating circuit comprising a sorber) appears on 47 US grants and 35 published applications in this corpus.
Search patents in H05K- Granted patents
- 47
- Published applications
- 35
- Assignees
- 25
- Inventors
- 93
- Latest grant
- 16 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 11 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 2 |
| 2003 | 2 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 3 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 3 |
| 2015 | 0 | 1 |
| 2016 | 2 | 2 |
| 2017 | 2 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 3 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 3 |
| 2023 | 1 | 1 |
| 2024 | 2 | 2 |
| 2025 | 1 | 2 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Cooling apparatus and data center15 Oct 2024US 12,120,855 B2Huawei Digital Power Technologies Co., Ltd.
- Heat recovery for datacenter cooling systems20 Feb 2024US 11,910,576 B2NVIDIA Corporation
- Heat dissipation device with sorbent material immersed in liquid7 Mar 2023US 11,602,077 B2GM Global Technology Operations LLC
- Refrigeration system and refrigeration method for data center1 Mar 2022US 11,266,042 B2Beijing Baidu Netcom Science Technology Co., Ltd.
- System for cooling a data center17 Sep 2026US 2026/0282292 A1
- Heat dissipation apparatus for electronic device21 May 2026US 2026/0143640 A1Kmw Inc.
- Heat and mass exchanger assemblies16 Apr 2026US 2026/0102734 A1Blue Frontier Inc.
- Modular datacenter29 Jan 2026US 2026/0032865 A1Rexes Corporation
- Active heat dissipation apparatus and manufacturing method of same30 Oct 2025US 2025/0338445 A1Kmw Inc.
Most cited
By later US patents
- Cooling apparatus for electronic and computer components59US 5,271,239 ARocky Research · 1993
- Heat transfer apparatus and methods for solid-vapor sorption systems55US 5,477,706 ARocky Research · 1995
- Cooling apparatus for electronic and computer components33US 5,396,775 ARocky Research · 1995
- Cooling integrated circuits using a cold plate with two phase thin film evaporation33US 7,265,979 B2Intel Corporation · 2007
- Method and apparatus for cooling electrical components28US 5,855,119 ASun Microsystems, Inc. · 1999