Heat dissipation device with sorbent material immersed in liquid
AssigneeGM Global Technology Operations LLC
InventorsChih-hung Yen, Nicholas W. Pinto, Anne M. Dailly, Nathan Thompson
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AssigneeGM Global Technology Operations LLC
InventorsChih-hung Yen, Nicholas W. Pinto, Anne M. Dailly, Nathan Thompson
Estimating the term…
A heat dissipation device for an electronics cooling system having an electronic component includes a housing that defines a chamber. The device further includes a first liquid, which is contained within the chamber and has a first boiling temperature. The device further includes a sorbent material immersed within the first liquid. The device further includes a second liquid, which is adsorbed by the sorbent material and has a second boiling temperature that is above the first boiling temperature. The first liquid vaporizes into a first vapor, in response to the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material, in response to the second liquid and the sorbent material reaching a desorption temperature that is below the second boiling temperature. The second liquid vaporizes into a second vapor, in response to the second liquid reaching the second boiling temperature.
A heat dissipation device for an electronics cooling system having an electronic component that generates heat in response to receiving an electric current, the heat dissipation device comprising:
An electronics cooling system comprising:
A method of operating an electronics cooling system having an electronic component and a heat dissipation device attached to the electronic component, with the heat dissipation device including a housing attached to the electronic component and having a surface defining a chamber, a first liquid contained within the chamber and having a first boiling temperature, a first sorbent material immersed within the first liquid, a second liquid adsorbed by at least the first sorbent material and having a second boiling temperature that is above the first boiling temperature of the first liquid, at least one thermocouple attached to at least one of the electronic component and the heat dissipation device, and a controller, the method comprising:
Dependencies are inferred from the claim text.