Cooling integrated circuits using a cold plate with two phase thin film evaporation
AssigneeIntel Corporation
InventorsHakan Erturk, Ioan Sauciuc
Life of this patent
Estimating the term…
Abstract
A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.
Claims18
A cold plate assembly comprising:
- a liquid flow passage;
- a cold plate along said passage;
- and
- a chamber, said chamber including a semi-permeable wall to allow gas generated at said cold plate to pass from said passage and to prevent the passage of liquid from said passage through said wall, said wall fanned directly opposing said cold plate.
A method comprising:
- removing heat from an integrated circuit using a cooling liquid flowing over a cold plate;
- transferring the heat from the cooling liquid in a heat exchanger;
- and
- separating gas from said cooling liquid flowing over said cold plate before said cooling liquid reaches said heat exchanger.
A device comprising:
- an integrated circuit chip;
- a cold plate thermally coupled to said chip;
- a flow passage for the flow of cooling fluid over said cold plate;
- a chamber formed in said passage having a membrane to allow gas to pass and to prevent the passage of liquid;
- a heat exchanger along said flow passage;
- and
- said chamber positioned along said flow passage before said heater exchanger so that the cooling fluid passes said chamber and then said heat exchanger, and said gas is removed from said passage by said membrane at a point prior to the cooling fluid reaching said heat exchanger.
An electronic device comprising:
- an integrated circuit;
- a cold plate thermally coupled to said circuit;
- a flow passage for the flow of cooling fluid over said plate;
- a chamber formed in said passage, said chamber having a semi-permeable wall to allow gas to pass and to prevent the passage of cooling liquid;
- a condenser coupled to said flow passage, said condenser receiving the gas from said chamber.
Dependencies are inferred from the claim text.