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US 2026/0282292 A1Published application
System for cooling a data center
OwnerEdwin Kohlinventor
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OwnerEdwin Kohlinventor
Estimating the term…
The present invention discloses a system for cooling a data center, in particular an artificial intelligence (AI) data center, comprising a plurality of computing modules (10) with semiconductor components which represent a heat source during operation, a cooling device for cooling the computing modules (10) by means of a coolant fluid circuit, the cooling device having an adsorption cooling device (50) with an evaporator (V), a condenser (K), and at least two adsorption/desorption elements (Ads/Des) forming the coolant fluid circuit, the condenser (K) having a thermal interface (51) for releasing heat to a reservoir (56), and a cold storage device (60) which is controllably thermally coupled via a first thermal interface (61) to the evaporator (V) of the adsorption cooling device (50) for buffer storage of a portion of the cold discharged by the evaporator (V).
A system for cooling a data center comprising a plurality of computing modules with semiconductor devices, the semiconductor devices representing a heat source during operation, the system having:
A method for cooling a data center comprising a plurality of computing modules with semiconductor devices, the semiconductor devices representing a heat source during operation, the method comprising:
Dependencies are inferred from the claim text.