H05K 7/20381
Thermal management
Official title: {Thermal management, e.g. evaporation control}
H05K7/20381 (Thermal management) appears on 234 US grants and 328 published applications in this corpus.
Search patents in H05K- Granted patents
- 234
- Published applications
- 328
- Assignees
- 159
- Inventors
- 661
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 7 | 9 |
| 2004 | 4 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 2 | 5 |
| 2013 | 1 | 0 |
| 2014 | 1 | 5 |
| 2015 | 3 | 10 |
| 2016 | 2 | 9 |
| 2017 | 7 | 16 |
| 2018 | 15 | 12 |
| 2019 | 18 | 20 |
| 2020 | 17 | 18 |
| 2021 | 16 | 24 |
| 2022 | 14 | 37 |
| 2023 | 22 | 42 |
| 2024 | 34 | 35 |
| 2025 | 39 | 35 |
| 2026 | 23 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Phase change heat sink transpiration cooling29 Sep 2026US 12,750,975 B2Raytheon Company
- Apparatus and system for cooling22 Sep 2026US 12,745,367 B2Accelsius, LLC
- Vapor chamber with dynamically adjustable local evaporative resistance15 Sep 2026US 12,740,017 B2Intel Corporation
- Cooling module assembly for pole-mounted network node8 Sep 2026US 12,733,128 B2Telefonaktiebolaget LM Ericsson (publ)
- Passive thermally-switched heat transfer system1 Sep 2026US 12,727,122 B1United States of America as represented by the Administrator of NASA
- Method for operating a cooling device in the event of a leakage and a corresponding cooling device8 Oct 2026US 2026/0313845 A1Rittal GmbH & Co.KG
- Vertical power supply assembly and smart card assembly with integrated heat sink1 Oct 2026US 2026/0299657 A1MetaPWR Electronics Co., Ltd.
- Multimode immersion cooling using coolant with no flash point, high heat of vaporization and high thermal conductivity1 Oct 2026US 2026/0304695 A1Nano and Advanced Materials Institute Limited
- Immersion cooling system for integrated circuit1 Oct 2026US 2026/0304696 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid thermal management method for battery integrated residential heat pump1 Oct 2026US 2026/0304697 A1Carrier Corporation
Most cited
By later US patents
- Cooling system for electronic equipment95US 4,729,424 ANEC Corporation · 1988
- Apparatus for controlling the temperature of an integrated circuit package89US 4,848,090 ATexas Instruments Incorporated · 1989
- System and methods for cooling electronic equipment76US 9,119,326 B2Inertech IP LLC · 2015
- Electronic device cooling system75US 8,223,495 B1Exaflop LLC · 2012
- Multi-layered micro-channel heat sink, devices and systems incorporating same69US 6,675,875 B1The Ohio State University · 2004