Electronic Circuit Board and Immersion Cooling Apparatus for the Same

Abstract

An immersion cooling apparatus comprises a housing configured to store a coolant; a plurality of electronic circuit boards disposed inside the housing and positioned to be immersed in the coolant; and a heat exchange device in fluid connection with the housing and configured to remove heat absorbed by the coolant from the plurality of electronic circuit boards. At least one of the plurality of electronic circuit boards comprises a substrate; a plurality of electronic components mounted on the substrate; and at least one coalescing unit disposed on the substrate between two electronic components of the plurality of electronic components, the at least one coalescing unit configured to intercept and coalesce a plurality of first vapor bubbles generated by heating of the coolant proximate to the plurality of electronic components into a second vapor bubble having a size greater than each of the plurality of first vapor bubbles.

Dependencies are inferred from the claim text.