Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling

A cooled electronic module comprising:

• a substrate and an electronic device to be cooled, the electronic device being disposed above the substrate;
• and a cooling apparatus for cooling the electronic device, the cooling apparatus comprising:
• a housing configured to at least partially surround and form a sealed compartment about the electronic device, the sealed compartment being fluid-tight;
• a dielectric fluid disposed within the sealed compartment, wherein the electronic device to be cooled is at least partially immersed within the dielectric fluid;
• at least one pump disposed within the sealed compartment for actively pumping the dielectric fluid disposed within the sealed compartment towards the electronic device, the at least one pump comprising an impingement-cooling, immersed pump disposed within the sealed compartment, the impingement-cooling, immersed pump actively pumping the dielectric fluid drawn via an inlet from a lower region of the sealed compartment towards the electronic device to be cooled;
• and an at least partially submerged baffle disposed adjacent to at least one side of the electronic device to be cooled to facilitate directing of dielectric fluid vapor to an upper region of the sealed compartment, and away from the dielectric fluid in the lower region of the sealed compartment being drawn into the impingement-cooling, immersed pump for active pumping via an outlet towards the electronic device to be cooled, wherein the inlet and the outlet of the impingement-cooling, immersed pump are disposed on different sides of the at least partially submerged baffle.

A method of fabricating a cooled electronic module comprising:

• securing a housing about an electronic device to be cooled, the housing being configured to at least partially surround and form a sealed compartment about the electronic device to be cooled;
• disposing dielectric fluid within the sealed compartment, wherein the electronic device to be cooled is at least partially immersed within the dielectric fluid;
• disposing at least one pump within the sealed compartment for actively pumping the dielectric fluid disposed within the sealed compartment towards the electronic device to be cooled, wherein the at least one pump comprises an impingement-cooling, immersed pump disposed within the sealed compartment and configured to actively pump the dielectric fluid drawn from a lower region of the sealed compartment towards the electronic device to be cooled;
• and providing an at least partially submerged baffle disposed adjacent to at least one side of the electronic device to be cooled to facilitate directing of dielectric fluid vapor to an upper region of the sealed compartment, and away from the dielectric fluid in the lower region of the sealed compartment being drawn into the impingement-cooling, immersed pump for active pumping via an outlet towards the electronic device to be cooled, wherein the inlet and the outlet of the impingement-cooling, immersed pump are disposed on different sides of the at least partially submerged baffle.