H05K 7/203
By immersion
Official title: {by immersion}
H05K7/203 (By immersion) appears on 435 US grants and 635 published applications in this corpus.
Search patents in H05K- Granted patents
- 435
- Published applications
- 635
- Assignees
- 154
- Inventors
- 866
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 5 |
| 2011 | 4 | 7 |
| 2012 | 3 | 0 |
| 2013 | 4 | 12 |
| 2014 | 5 | 15 |
| 2015 | 14 | 18 |
| 2016 | 16 | 11 |
| 2017 | 10 | 20 |
| 2018 | 19 | 17 |
| 2019 | 16 | 20 |
| 2020 | 26 | 37 |
| 2021 | 29 | 35 |
| 2022 | 31 | 68 |
| 2023 | 55 | 112 |
| 2024 | 64 | 98 |
| 2025 | 82 | 84 |
| 2026 | 42 | 73 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Immersion cooling system implementing a first container and a second container6 Oct 2026US 12,757,351 B2Ovh
- Immersion cooling system6 Oct 2026US 12,757,352 B2Wiwynn Corporation
- Heat exchanger module for immersion cooling system6 Oct 2026US 12,757,353 B2Man Zai Industrial Co., Ltd.
- Immersion cooling system15 Sep 2026US 12,740,013 B2Aewin Technologies Co., Ltd.
- Fluid immersion cooling system15 Sep 2026US 12,740,014 B2Bitmain Technologies Inc.
- Electronic Circuit Board and Immersion Cooling Apparatus for the Same8 Oct 2026US 2026/0313839 A1SK Innovation Co., Ltd.
- Test board for characterizing dendrite growth in immersion-cooling systems1 Oct 2026US 2026/0299008 A1MTS IP Holdings Ltd
- Multimode immersion cooling using coolant with no flash point, high heat of vaporization and high thermal conductivity1 Oct 2026US 2026/0304695 A1Nano and Advanced Materials Institute Limited
- Immersion cooling system for integrated circuit1 Oct 2026US 2026/0304696 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Two-phase immersion cooling for electronic devices24 Sep 2026US 2026/0293050 A1Rosseau Group International Inc.
Most cited
By later US patents
- Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling143US 8,014,150 B2International Business Machines Corporation · 2011
- Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments79US 6,019,167 ANortel Networks Limited · 2000
- Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow79US 7,885,070 B2International Business Machines Corporation · 2011
- Liquid-cooled electronics rack with immersion-cooled electronic subsystems79US 8,184,436 B2International Business Machines Corporation · 2012
- Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device79US 8,194,406 B2International Business Machines Corporation · 2012