Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow

A cooled electronics rack comprising:

• an electronics rack at least partially surrounding and supporting at least one electronic system chassis, the at least one electronic system chassis comprising at least one electronic system, each electronic system comprising multiple different types of electronic components;
• and
• at least one apparatus for facilitating cooling of the at least one electronic system, each apparatus of the at least one apparatus comprising:
• a container sized to accommodate therein a respective electronic system of the at least one electronic system;
• a coolant inlet port and a coolant outlet port associated with the container for facilitating ingress and egress of coolant through the container, the container comprises a wash flow opening in fluid communication with the coolant inlet port for passing a portion of coolant ingressing therethrough through the container as a coolant wash flow, wherein when coolant flows through the container, different types of electronic components of the electronic system disposed therein are immersion-cooled by the coolant wash flow passing thereacross;
• and
• a manifold structure disposed within the container, the manifold structure comprising a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port for receiving a portion of the coolant ingressing therethrough, and a plurality of jet flow orifices in fluid communication with the coolant jet plenum, the plurality of jet flow orifices being positioned to facilitate jet flow cooling of at least one electronic component of the electronic system by jet impingement of coolant thereon when coolant flows through the container.

A method of facilitating cooling of an electronic system, the method comprising:

• providing a container sized to receive an electronic system therein, and a coolant inlet port and a coolant outlet port associated with the container for facilitating ingress and egress of coolant through the container, the container further including a wash flow opening in fluid communication with the coolant inlet port for passing a portion of coolant ingressing therethrough through the container as a coolant wash flow, and the electronic system comprising multiple different types of electronic components to be immersion-cooled, wherein when the electronic system is operatively positioned within the container and coolant flows therethrough, different types of electronic components of the electronic system are immersion-cooled by the coolant wash flow passing thereacross;
• and
• providing a manifold structure disposed within the container, the manifold structure comprising a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port for receiving at least a portion of the coolant ingressing therethrough, and a plurality of jet flow orifices in fluid communication with the coolant jet plenum, the plurality of jet flow orifices being positioned to facilitate jet flow cooling of at least one electronic component of the electronic system by jet impingement of coolant thereon when the electronic system is operatively positioned within the container.