Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device

A cooled electronic device comprising:

• a substrate;
• at least one electronic device coupled to the substrate;
• and
• a cooling apparatus for cooling the at least one electronic device, the cooling apparatus comprising:
• a coolant flow path in fluid communication with the at least one electronic device, the coolant flow path accommodating a liquid dielectric coolant, wherein upon contacting a surface to be cooled associated with the at least one electronic device, the liquid dielectric coolant in the coolant flow path vaporizes to form dielectric coolant vapor, thereby facilitating cooling of the surface to be cooled;
• a vapor condenser in fluid communication with the coolant flow path for facilitating coolant condensate formation from the dielectric coolant vapor within the coolant flow path;
• and
• at least one dielectric coolant vapor fan disposed within the coolant flow path to facilitate movement of dielectric coolant vapor into contact with the vapor condenser, and thereby facilitate cooling of the surface to be cooled associated with the at least one electronic device through enhanced coolant condensate formation and thus enhanced return of the dielectric coolant vapor to the liquid dielectric coolant.

A method of facilitating cooling of an electronic device, the method comprising:

• providing a liquid dielectric coolant in contact with the electronic device during operation thereof, wherein the liquid dielectric coolant vaporizes to form dielectric coolant vapor, thereby facilitating cooling of the electronic device;
• providing a vapor condenser in fluid communication with a coolant flow path accommodating the liquid dielectric coolant for facilitating coolant condensate formation from the dielectric coolant vapor within the coolant flow path;
• and
• utilizing at least one dielectric coolant vapor fan disposed within the coolant flow path to actively move the dielectric coolant vapor into contact with the vapor condenser, and thereby facilitate cooling of the electronic device by facilitating coolant condensate formation, and thus return of the dielectric coolant vapor to the liquid dielectric coolant within the coolant flow path.