Immersion cooling system

An immersion cooling system, comprising:

• a box body having a first accommodating space and a second accommodating space arranged along a first direction, wherein the first accommodating space accommodates a heat dissipation medium and at least one heating chip immersed in the heat dissipation medium, wherein the heat dissipation medium is gasified after absorbing a heat energy of the heating chip, and the gasified heat dissipation medium moves from the first accommodating space to the second accommodating space;
• a condenser arranged in the second accommodating space along the first direction and a second direction perpendicular to the first direction, wherein the condenser is used to enable the gasified heat dissipation medium to undergo heat exchange, condensation and liquefaction, wherein the condenser is defined with an upper half portion and a lower half portion in the first direction;
• and
• at least one valve disposed on the box body along the second direction, corresponding to the second accommodating space, and aligned with the upper half portion of the condenser along a third direction perpendicular to the first direction and the second direction,
• wherein the gasified heat dissipation medium flows and impacts the condenser along the third direction to blow off the liquefied heat dissipation medium attached onto the condenser when the valve is opened.