Fluid immersion cooling system
AssigneeBitmain Technologies Inc.
InventorsYinchuang Yang, Minghao Li, Zhaoxiang Zeng, Te Pi, Zesen Nie
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AssigneeBitmain Technologies Inc.
InventorsYinchuang Yang, Minghao Li, Zhaoxiang Zeng, Te Pi, Zesen Nie
Estimating the term…
The present application provides a fluid immersion cooling system, including a housing, a circuit board and a partition. There are a plurality of circuit boards, the plurality of circuit boards are spaced apart from each other in an accommodating cavity and are all located at a bottom of the housing, and a side of the circuit board close to the bottom of the housing is provided with a guide hole. There are a plurality of partitions, and one partition is located between two adjacent circuit boards and spaced apart from the corresponding circuit board. Areas between the partitions and the circuit boards, top areas of the partitions and the guide holes together form a continuously bent flow channel for the cooling liquid to flow.
A fluid immersion cooling system, comprising a housing, a circuit board and a partition, wherein the housing has an accommodating cavity, and the accommodating cavity is configured for accommodating cooling liquid;
Dependencies are inferred from the claim text.