H05K 2203/0789
Aqueous acid solution
Official title: Aqueous acid solution, e.g. for cleaning or etching
H05K2203/0789 (Aqueous acid solution) appears on 106 US grants and 120 published applications in this corpus.
Search patents in H05K- Granted patents
- 106
- Published applications
- 120
- Assignees
- 104
- Inventors
- 433
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 6 |
| 2005 | 3 | 4 |
| 2006 | 1 | 4 |
| 2007 | 2 | 2 |
| 2008 | 0 | 5 |
| 2009 | 2 | 2 |
| 2010 | 2 | 6 |
| 2011 | 1 | 4 |
| 2012 | 1 | 2 |
| 2013 | 1 | 2 |
| 2014 | 1 | 7 |
| 2015 | 4 | 8 |
| 2016 | 7 | 7 |
| 2017 | 2 | 2 |
| 2018 | 3 | 6 |
| 2019 | 2 | 7 |
| 2020 | 1 | 10 |
| 2021 | 9 | 6 |
| 2022 | 2 | 3 |
| 2023 | 4 | 3 |
| 2024 | 2 | 5 |
| 2025 | 2 | 11 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Enhanced subtractive etch anisotropy using etch rate gradient8 Sep 2026US 12,733,107 B2Intel Corporation
- Silver-based transparent conductive layers interfaced with copper traces and methods for forming the structures3 Mar 2026US 12,568,783 B2EKC Technology, Inc.
- Wiring board manufacturing method and wiring board4 Nov 2025US 12,463,056 B2Toppan Inc.
- Concentrated liquid of polishing composition and polishing method using same1 Apr 2025US 12,264,265 B2Fujimi Incorporated
- Electroless plating process25 Jun 2024US 12,018,378 B2Kojima Chemicals Co., Ltd.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Production method of embedded circuit board10 Sep 2026US 2026/0271193 A1Olympic Circuit Technology Co., Ltd.
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Method for producing conductive base material, method for producing electronic device, method for producing electromagnetic shield film, method for producing sheet-like heating element, and conductive base material26 Feb 2026US 2026/0055513 A1Sato Holdings Kabushiki Kaisha
Most cited
By later US patents
- Flexible circuit electrode array and method of manufacturing the same83US 7,877,866 B1Second Sight Medical Products, Inc. · 2011
- Multichip-module having an HDI and a temporary supporting substrate59US 5,654,590 AFujitsu Limited · 1997
- Multilayer printed circuit board and method of producing the same48US 5,827,604 AIbiden Co., Ltd. · 1998
- A process for removing corrosive by-products from a circuit assembly45US 5,288,332 AHoneywell Inc. · 1994
- Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board45US 6,248,428 B1Ibiden Co., Ltd. · 2001