Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board

A material composition for the preparation an adhesive for electroless plating comprising the following groups 1-3 prepared and preserved in a separated manner to one another in advance of mixing:

• group 1:
• a resin composition comprising an uncured thermosetting resin which becomes hardly soluble in acid or oxidizing agent through curing treatment;
• group 2:
• a resin composition comprising cured heat-resistant resin particles soluble in acid or oxidizing agent, a thermoplastic resin, and an organic solvent;
• and
• group 3:
• a curing agent composition;
• wherein a mixing proportion of the resin particles of group 2 is 5-50% by weight to a solid content in the prepared adhesive.

A material composition for the preparation an adhesive for electroless plating comprising the following groups 1-3 prepared and preserved in a separated manner to one another in advance of mixing:

• group 1:
• a resin composition comprising an uncured thermosetting resin which becomes hardly soluble in acid or oxidizing agent through curing treatment;
• group 2:
• a resin composition comprising cured heat-resistant resin particles soluble in acid or oxidizing agent, a thermoplastic resin, and an organic solvent;
• and
• group 3:
• a curing agent composition;
• wherein the resin particles in group 2 have an average particle size of less than 2 μm and comprise 40-80 parts by weight rough particles and 10-40 parts by weight fine particles to 100 parts by weight of the thermoplastic resin of group 2.

A material composition for the preparation an adhesive for electroless plating comprising the following groups 1-3 prepared and preserved in a separated manner to one another in advance of mixing:

• group 1:
• a resin composition comprising an uncured thermosetting resin which becomes hardly soluble in acid or oxidizing agent through curing treatment;
• group 2:
• a resin composition comprising cured heat-resistant resin particles soluble in acid or oxidizing agent, a thermoplastic resin, and an organic solvent;
• and
• group 3:
• a curing agent composition;
• wherein a mixing proportion of the thermosetting resin in group 1 to the thermoplastic resin in group 2 is 1:4 to 4:1 by weight.