H05K 2201/10318
Surface mounted metallic pins
H05K2201/10318 (Surface mounted metallic pins) appears on 395 US grants and 376 published applications in this corpus.
Search patents in H05K- Granted patents
- 395
- Published applications
- 376
- Assignees
- 196
- Inventors
- 828
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 13 | 0 |
| 2000 | 9 | 0 |
| 2001 | 18 | 12 |
| 2002 | 14 | 20 |
| 2003 | 12 | 11 |
| 2004 | 12 | 13 |
| 2005 | 12 | 11 |
| 2006 | 11 | 11 |
| 2007 | 10 | 15 |
| 2008 | 7 | 19 |
| 2009 | 8 | 25 |
| 2010 | 11 | 15 |
| 2011 | 11 | 8 |
| 2012 | 19 | 13 |
| 2013 | 8 | 9 |
| 2014 | 2 | 9 |
| 2015 | 7 | 13 |
| 2016 | 16 | 10 |
| 2017 | 13 | 10 |
| 2018 | 14 | 22 |
| 2019 | 15 | 16 |
| 2020 | 21 | 22 |
| 2021 | 21 | 21 |
| 2022 | 14 | 14 |
| 2023 | 18 | 14 |
| 2024 | 13 | 19 |
| 2025 | 15 | 16 |
| 2026 | 9 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- PCB for an IC chip with D-PHY function and C-PHY function and an PCB assembly including the IC chip21 Jul 2026US 12,690,126 B2Aptiv Technologies AG
- Circuit board, chip on film, display apparatus and bonding method14 Jul 2026US 12,684,699 B2Boe Technology Group Co., Ltd.
- Substrate structure connected on basis of solder ball and elastic body7 Jul 2026US 12,677,371 B2Samsung Electronics Co., Ltd.
- Electric power converting device, and board-to-board connecting portion16 Jun 2026US 12,658,625 B2Panasonic Automotive Systems Co., Ltd.
- Semiconductor device2 Jun 2026US 12,648,084 B2Fuji Electric Co., Ltd.
- Electronic supply device for electrically connecting an electrical consumer and electronic consumer device24 Sep 2026US 2026/0293028 A1H4X e.U.
- Semiconductor device, semiconductor module, power conversion unit, and method for manufacturing semiconductor device17 Sep 2026US 2026/0280165 A1Rohm Co., Ltd.
- Semiconductor device10 Sep 2026US 2026/0271192 A1Fuji Electric Co., Ltd.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Self-centering electrical contacts2 Jul 2026US 2026/0188932 A1Raytheon Company
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999