Circuit board, chip on film, display apparatus and bonding method

A chip on film for bonding with a circuit board having a plurality of bonding regions, wherein each bonding region comprises:

• a plurality of first pins extending along a first direction and sequentially arranged along a second direction;
• and at least one first alignment mark group on an arrangement path along which the plurality of first pins are arranged, and the chip on film comprises:
• a plurality of second pins extending along the first direction and sequentially arranged along the second direction;
• and
• at least one second alignment mark group on an arrangement path along which the plurality of second pins are arranged,
• wherein the at least one first alignment mark group is configured to be aligned with the at least one second alignment mark group in a buckled way, so that the plurality of first pins are bonded and attached to the plurality of second pins in one-to-one correspondence.