H05K 2201/1031
Surface mounted metallic connector elements
H05K2201/1031 (Surface mounted metallic connector elements) appears on 692 US grants and 710 published applications in this corpus.
Search patents in H05K- Granted patents
- 692
- Published applications
- 710
- Assignees
- 376
- Inventors
- 1,523
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 9 | 0 |
| 1997 | 9 | 0 |
| 1998 | 11 | 0 |
| 1999 | 17 | 0 |
| 2000 | 13 | 0 |
| 2001 | 20 | 15 |
| 2002 | 20 | 32 |
| 2003 | 16 | 15 |
| 2004 | 19 | 14 |
| 2005 | 19 | 17 |
| 2006 | 14 | 18 |
| 2007 | 13 | 20 |
| 2008 | 12 | 26 |
| 2009 | 16 | 43 |
| 2010 | 17 | 29 |
| 2011 | 20 | 17 |
| 2012 | 30 | 23 |
| 2013 | 16 | 29 |
| 2014 | 13 | 28 |
| 2015 | 27 | 33 |
| 2016 | 37 | 24 |
| 2017 | 30 | 31 |
| 2018 | 24 | 33 |
| 2019 | 37 | 49 |
| 2020 | 45 | 46 |
| 2021 | 38 | 33 |
| 2022 | 28 | 27 |
| 2023 | 30 | 27 |
| 2024 | 26 | 34 |
| 2025 | 25 | 32 |
| 2026 | 14 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board unit and electronic apparatus6 Oct 2026US 12,757,325 B2Seiko Epson Corporation
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- PCB for an IC chip with D-PHY function and C-PHY function and an PCB assembly including the IC chip21 Jul 2026US 12,690,126 B2Aptiv Technologies AG
- Circuit board, chip on film, display apparatus and bonding method14 Jul 2026US 12,684,699 B2Boe Technology Group Co., Ltd.
- Substrate structure connected on basis of solder ball and elastic body7 Jul 2026US 12,677,371 B2Samsung Electronics Co., Ltd.
- Electronic supply device for electrically connecting an electrical consumer and electronic consumer device24 Sep 2026US 2026/0293028 A1H4X e.U.
- Semiconductor device, semiconductor module, power conversion unit, and method for manufacturing semiconductor device17 Sep 2026US 2026/0280165 A1Rohm Co., Ltd.
- Semiconductor device10 Sep 2026US 2026/0271192 A1Fuji Electric Co., Ltd.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Self-centering electrical contacts2 Jul 2026US 2026/0188932 A1Raytheon Company
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999