Semiconductor device

A semiconductor device, comprising:

• a first arm portion;
• and
• a second arm portion adjacent to the first arm portion, wherein
• the first arm portion includes:
• a plurality of first semiconductor chips, each including an input electrode on a rear surface and an output electrode on a front surface thereof;
• and
• a first insulated circuit board that is rectangular, and has a first side, a second side, a third side, and a fourth side successively adjacently disposed in this order, the first insulated circuit board including a first input wiring board extending in a first direction parallel to a direction in which the first and the third sides extend, and two first output wiring boards extending in the first direction,
• the first input wiring board includes a first input region electrically connected to an input terminal and a first chip bonding region to which the plurality of first semiconductor chips are bonded, the first input region being located closer to the fourth side of the first insulated circuit board than is the first chip bonding region,
• the two first output wiring boards are disposed at opposite sides in a second direction perpendicular to the first direction and parallel to a direction in which the second and fourth sides extend, such that the first input wiring board is sandwiched between the two first output wiring boards, each first output wiring board including a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips, the first output region being located closer to the fourth side of the first insulated circuit board than is the first connection wiring region,
• the second arm portion includes:
• a plurality of second semiconductor chips which each include an input electrode on a rear surface and an output electrode on a front surface thereof, and
• a second insulated circuit board that is rectangular and has a fifth side, a sixth side, a seventh side, and an eighth side successively adjacently disposed in this order, the second insulated circuit board including a second output wiring board and a second input wiring board that each extend in a third direction parallel to a direction in which the fifth and seventh sides extend and are adjacent to each other in a fourth direction that is perpendicular to the third direction and is parallel to a direction in which the sixth and eighth sides extend,
• the second input wiring board includes a second input region electrically connected to the first output region and a second chip bonding region to which the plurality of second semiconductor chips are bonded, the second input region being located closer to the sixth side than to the eighth side of the second insulated circuit board, the second chip bonding region facing the second output wiring board,
• the second output wiring board includes a second output region electrically connected to a second output terminal, and a second connection wiring region electrically connected to the output electrodes of the plurality of second semiconductor chips, the second output region being located closer to the sixth side of the second insulated circuit board than is the second connection wiring region,
• the second arm portion is adjacent to the first arm portion such that the sixth side of the second insulated circuit board faces the fourth side of the first insulated circuit board, and
• the first input region, the first output region, and the second output region are positioned adjacent to a boundary line between the fourth side and the sixth side.

A semiconductor device, comprising:

• a first arm portion, and
• a second arm portion adjacent to the first arm portion, wherein
• the first arm portion includes:
• a plurality of first semiconductor chips, each including an input electrode on a rear surface and an output electrode on a front surface thereof;
• and
• a first insulated circuit board that is rectangular, and has a first side, a second side, a third side, and a fourth side successively adjacently disposed in this order, the first insulated circuit board including a first input wiring board extending in a first direction parallel to a direction in which the first and the third sides extend, and a first output wiring board extending in the first direction, being adjacent to the first input wiring board in a second direction perpendicular to the first direction and parallel to a direction in which the second and fourth sides extend, and being closer to one of the first side or the third side of the first insulated circuit board than is the first input wiring board, wherein
• the first input wiring board is formed in a T shape in a plan view of the semiconductor device and includes a first input region electrically connected to an input terminal and a first chip bonding region to which the plurality of first semiconductor chips are bonded, the first input region being located closer to the fourth side of the first insulated circuit board than is the first chip bonding region,
• the first output wiring board extends in the first direction, to face the plurality of first semiconductor chips and includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips, the first output region being located closer to the fourth side of the first insulated circuit board than is the first connection wiring region, the input terminal being sandwiched between the
• the second arm portion includes:
• a plurality of second semiconductor chips which each include an input electrode on a rear surface and an output electrode on a front surface thereof, and
• a second insulated circuit board that is rectangular and has a fifth side, a sixth side, a seventh side, and an eighth side successively adjacently disposed in this order, the second insulated circuit board including a second output wiring board and a second input wiring board that each extend in a third direction parallel to a direction in which the fifth and seventh sides extend and are adjacent to each other in a fourth direction that is perpendicular to the third direction and is parallel to a direction in which the sixth and eighth sides extend,
• the second input wiring board includes a second input region electrically connected to the first output region and a second chip bonding region to which the plurality of second semiconductor chips are bonded, the second input region being located closer to the sixth side than to the eighth side of the second insulated circuit board, the second chip bonding region facing the second output wiring board,
• the second output wiring board includes a second output region electrically connected to a second output terminal, and a second connection wiring region electrically connected to the output electrodes of the plurality of second semiconductor chips, the second output region being located closer to the sixth side of the second insulated circuit board than is the second connection wiring region, and
• the second chip bonding region of the second input wiring board is formed in a U shape in a plan view of the semiconductor device so as to surround the second output wiring board along the fifth side, the eighth side, and the seventh side of the second insulated circuit board, wherein
• the first output wiring board includes two first output wiring boards, each of the two first output wiring boards including a terminal bonding region to which the output terminal is bonded,
• the two first output wiring boards are located between the first input wiring board and the first side and between the first input wiring board and the third side, respectively, and
• the first input region includes a terminal bonding region to which the input terminal is bonded, the terminal bonding region of the first input region being located, in the second direction, between the first output regions of the two first output wiring boards.