H05K 2201/09645
Patterning on via walls
Official title: Patterning on via walls; Plural lands around one hole
H05K2201/09645 (Patterning on via walls) appears on 274 US grants and 281 published applications in this corpus.
Search patents in H05K- Granted patents
- 274
- Published applications
- 281
- Assignees
- 158
- Inventors
- 586
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 8 | 0 |
| 2001 | 4 | 2 |
| 2002 | 11 | 10 |
| 2003 | 9 | 13 |
| 2004 | 11 | 13 |
| 2005 | 7 | 18 |
| 2006 | 11 | 22 |
| 2007 | 13 | 22 |
| 2008 | 11 | 19 |
| 2009 | 6 | 15 |
| 2010 | 15 | 8 |
| 2011 | 7 | 12 |
| 2012 | 13 | 7 |
| 2013 | 10 | 18 |
| 2014 | 12 | 9 |
| 2015 | 7 | 10 |
| 2016 | 2 | 6 |
| 2017 | 10 | 7 |
| 2018 | 9 | 11 |
| 2019 | 8 | 12 |
| 2020 | 15 | 14 |
| 2021 | 6 | 5 |
| 2022 | 8 | 14 |
| 2023 | 8 | 6 |
| 2024 | 6 | 3 |
| 2025 | 4 | 4 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Matching circuit board and semiconductor device28 Jul 2026US 12,696,380 B2Sumitomo Electric Device Innovations, Inc.
- Reusable modular substrate28 Jul 2026US 12,696,389 B2NXP USA, Inc.
- Cavity based power delivery and decoupling3 Feb 2026US 12,543,274 B2Cisco Technology, Inc.
- Printed circuit board12 Aug 2025US 12,389,533 B2Zte Corporation
- Component carrier with partially metallized hole using anti-plating dielectric structure and electroless plateable separation barriers6 May 2025US 12,295,108 B2AT&SAustria Technologie & Systemtechnik AG
- Via loss control in a printed circuit board29 Jan 2026US 2026/0032817 A1Dell Products L. P.
- Vertical conductive structure transition impedance optimization4 Sep 2025US 2025/0280493 A1International Business Machines Corporation
- Contact Hole Assembly and Electronic Device10 Apr 2025US 2025/0120017 A1LG Display Co., Ltd.
- Reusable modular substrate20 Feb 2025US 2025/0063657 A1NXP USA, Inc.
- Manufacturing method of circuit board13 Feb 2025US 2025/0056712 A1Unimicron Technology Corp.
Most cited
By later US patents
- Long range optical reader243US 7,055,747 B2Hand Held Products, Inc. · 2006
- Optical reader having a plurality of imaging modules219US 7,219,843 B2Hand Held Products, Inc. · 2007
- Single in-line memory module190US 5,973,951 ASun Microsystems, Inc. · 1999
- Single in-line memory module171US 5,465,229 ASun Microsystems, Inc. · 1995
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002