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US 5,973,951 AGranted
Single in-line memory module
AssigneeSun Microsystems, Inc.
InventorsAndreas Bechtolsheim, Edward Frank, James Testa, Shawn Storm
Life of this patent
Estimating the term…
Abstract
A single in-line memory module (SIMM) for memory expansion in a computer system. The SIMM includes a plurality of memory chips surface-mounted on a printed circuit board. The printed circuit board includes a dual read-out connector edge adapted for insertion within a socket of the computer system. One or more driver chips may further be mounted on the printed circuit board and connected to distribute control signals to the memory chips. A full-width data path may further be connected between the dual read-out connector edge and the plurality of memory chips.
Claims51
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- a driver chip mounted on the printed circuit board, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- and
- a full-width data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
2 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
2 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- a driver chip mounted on the printed circuit board between a first set of the plurality of memory chips and a second set of the plurality of memory chips, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- a driver chip mounted at a substantially central position on one side of the printed circuit board, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board, wherein some of the plurality of memory chips are mounted on the first side of the printed circuit board and others of the plurality of memory chips are mounted on the second side of the printed circuit board;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
2 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board, wherein some of the plurality of memory chips are mounted on the first side of the printed circuit board and others of the plurality of memory chips are mounted on the second side of the printed circuit board;
- a driver chip mounted at a substantially central position on one side of the printed circuit board, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- a driver chip mounted on the first side of the printed circuit board substantially midway between one edge of the printed circuit board and an opposite edge of the printed circuit board, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a full-width data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the computer system including a CPU coupled to a processor bus having a total of n data lines, where n is at least 64, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- a driver chip mounted on the printed circuit board, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a data path provided between the connector edge of the printed circuit board and the plurality of memory chips, wherein the data path is at least n bits wide;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the computer system including a CPU coupled to a processor bus having a total of n data lines, where n is at least 64, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- and
- a data path provided between the connector edge of the printed circuit board and the plurality of memory chips, wherein the data path is at least n bits wide;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
2 more elements
A single in-line memory module for memory expansion in a computer system, the computer system including a CPU coupled to a processor bus having a total of n data lines, where n is at least 64, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board, wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are configured to carry signals that are different from additional signals to be carried by corresponding pads of the second plurality of contact pads that are positioned opposite the first plurality of contact pads;
- a plurality of memory chips surface-mounted on the printed circuit board;
- a driver chip mounted on the printed circuit board between a first set of the plurality of memory chips and a second set of the plurality of memory chips, wherein the driver chip is connected to distribute at least one control signal to the plurality of memory chips;
- and
- a data path provided between the connector edge of the printed circuit board and the plurality of memory chips, wherein the data path is at least n bits wide;
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
3 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board;
- and
- a plurality of surface-mount memory chips mounted on the printed circuit board;
- wherein a full-width data path at least 64 bits in width is provided between the connector edge of the printed circuit board and the plurality of surface-mount memory chips;
- and
- wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are dedicated to electrical functions which are different from respective electrical functions of corresponding contact pads on the second side of the printed circuit board;
- and
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
5 more elements
A single in-line memory module for memory expansion in a computer system, the single in-line memory module comprising:
- a printed circuit board having a first side and a second side, wherein the printed circuit board includes a connector edge adapted for insertion within a socket of the computer system, the connector edge having a first plurality of contact pads on the first side of the printed circuit board and a second plurality of contact pads on the second side of the printed circuit board;
- a plurality of surface-mount memory chips mounted on the printed circuit board;
- a driver chip mounted on the printed circuit board and connected to distribute address signals to the plurality of surface-mount memory chips;
- and
- a data path at least 64 bits in width provided between the connector edge of the printed circuit board and the plurality of memory chips;
- wherein at least some of the first plurality of contact pads on the first side of the printed circuit board are dedicated to electrical functions which are different from respective electrical functions of corresponding contact pads on the second side of the printed circuit board;
- and
- wherein the printed circuit board is a multi-layered printed circuit board including at least three signal layers.
5 more elements
Dependencies are inferred from the claim text.