Reusable modular substrate

A device, comprising:

• an electronic component including a plurality of terminals,
• a base including a plurality of through-hole vias, wherein each through-hole via of the plurality of through-hole vias is electrically connected to a terminal of the plurality of terminals, wherein the electronic component is mounted to a first surface of the base, and
• a first plurality of magnetic material deposits on a second surface of the base, wherein the second surface is opposite the first surface, wherein the device is configured to couple to a substrate, wherein:
• the substrate includes a plurality of electrical interconnect pads on an outer surface of the substrate, and a second plurality of magnetic material deposits on the outer surface of the substrate,
• when the device is coupled to the substrate, each magnetic material deposit of the first plurality of magnetic material deposits is attracted by a magnetic force to a magnetic material deposit of the second plurality of magnetic deposits and each through-hole via of the plurality of through-hole vias is electrically connected to an electrical interconnect pad of the plurality of electrical interconnect pads, and
• at least one of the magnetic material deposits of the first plurality of magnetic material deposits and the magnetic material deposits of the second plurality of magnetic material deposits includes a permanent magnetic material.

A device, comprising:

• a substrate, including:
• a plurality of laminated layers,
• a plurality of electrical interconnect pads on an outer surface of the plurality of laminated layers, and
• a first plurality of magnetic material deposits on the outer surface of the plurality of laminated layers.