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US 12,696,389 B2Granted
Reusable modular substrate
AssigneeNXP USA, Inc.
InventorKabir Mirpuri
Life of this patent
Estimating the term…
Abstract
A device may include a substrate having a plurality of laminated layers and a plurality of electrical interconnect pads on an outer surface of the plurality of laminated layers. The substrate may include a first plurality of magnetic material deposits on the outer surface of the plurality of laminated layers. A device may mount to the substrate. The device includes an electronic component including a plurality of terminals, and a base including a plurality of through-hole. A second plurality of magnetic material deposits may be on a second surface of the base. When the device is coupled to the substrate, each magnetic material deposit of the first plurality of magnetic material deposits is attracted by a magnetic force to a magnetic material deposit of the second plurality of magnetic deposits.
Claims16
A system, comprising:
- a multi-layer printed circuit board (PCB), including:
- a plurality of laminated layers,
- a plurality of electrical interconnect pads on an outer surface of the plurality of laminated layers, and
- a first plurality of magnetic material deposits on the outer surface of the plurality of laminated layers;
- and
- a device coupled to the PCB, wherein the device includes:
- an electronic component including a plurality of terminals,
- a base including a plurality of through-hole vias, wherein each through-hole via of the plurality of through-hole vias is electrically connected to a terminal of the plurality of terminals, wherein the electronic component is mounted to a first surface of the base, wherein each through-hole via of the plurality of through-hole vias includes a solder material, and
- a second plurality of magnetic material deposits on a second surface of the base, wherein the second surface is opposite the first surface, wherein when the device is coupled to the PCB, each magnetic material deposit of the first plurality of magnetic material deposits is attracted by a magnetic force to a magnetic material deposit of the second plurality of magnetic deposits and each through-hole via of the plurality of through-hole vias is electrically connected to an electrical interconnect pad of the plurality of electrical interconnect pads, wherein at least one of the magnetic material deposits of the first plurality of magnetic material deposits and the magnetic material deposits of the second plurality of magnetic material deposits includes a permanent magnetic material, wherein when the device is coupled to the PCB the magnetic force causes at least a portion of the solder material to deform.
6 more elements
A device, comprising:
- an electronic component including a plurality of terminals,
- a base including a plurality of through-hole vias, wherein each through-hole via of the plurality of through-hole vias is electrically connected to a terminal of the plurality of terminals, wherein the electronic component is mounted to a first surface of the base, wherein each through-hole via of the plurality of through-hole vias includes a solder material and an outer coating of the solder material of the first through-hole via protrudes beyond a second surface of the base, and
- a first plurality of magnetic material deposits on the second surface of the base, wherein the second surface is opposite the first surface, wherein the device is configured to couple to a substrate, wherein:
- the substrate includes a plurality of electrical interconnect pads on an outer surface of the substrate, and a second plurality of magnetic material deposits on the outer surface of the substrate,
- when the device is coupled to the substrate, each magnetic material deposit of the first plurality of magnetic material deposits is attracted by a magnetic force to a magnetic material deposit of the second plurality of magnetic deposits and each through-hole via of the plurality of through-hole vias is electrically connected to an electrical interconnect pad of the plurality of electrical interconnect pads, and
- at least one of the magnetic material deposits of the first plurality of magnetic material deposits and the magnetic material deposits of the second plurality of magnetic material deposits includes a permanent magnetic material.
3 more elements
A device, comprising:
- a substrate, including:
- a plurality of laminated layers,
- a plurality of electrical interconnect pads on an outer surface of the plurality of laminated layers, and
- a first plurality of magnetic material deposits on the outer surface of the plurality of laminated layers;
- and
- an electronic component, including:
- a plurality of terminals,
- a base including a plurality of through-hole vias, wherein each through-hole via of the plurality of through-hole vias includes a solder material, wherein the electronic component is mounted to a first surface of the base, and
- a second plurality of magnetic material deposits on a second surface of the base, wherein the second surface is opposite the first surface, wherein when the electronic component is coupled to the substrate, each magnetic material deposit of the first plurality of magnetic material deposits is attracted by a magnetic force to a magnetic material deposit of the second plurality of magnetic deposits and each through-hole via of the plurality of through-hole vias is electrically connected to an electrical interconnect pad of the plurality of electrical interconnect pads, wherein at least one of the magnetic material deposits of the first plurality of magnetic material deposits and the magnetic material deposits of the second plurality of magnetic material deposits includes a permanent magnetic material, wherein when the electronic component is coupled to the substrate the magnetic force causes at least a portion of the solder material to deform.
6 more elements
Dependencies are inferred from the claim text.