H05K 2201/09636
Details of adjacent, not connected vias
H05K2201/09636 (Details of adjacent, not connected vias) appears on 139 US grants and 189 published applications in this corpus.
Search patents in H05K- Granted patents
- 139
- Published applications
- 189
- Assignees
- 104
- Inventors
- 452
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 3 |
| 2003 | 2 | 5 |
| 2004 | 3 | 5 |
| 2005 | 1 | 3 |
| 2006 | 4 | 2 |
| 2007 | 0 | 8 |
| 2008 | 2 | 10 |
| 2009 | 4 | 12 |
| 2010 | 8 | 8 |
| 2011 | 15 | 9 |
| 2012 | 8 | 4 |
| 2013 | 8 | 4 |
| 2014 | 1 | 3 |
| 2015 | 4 | 7 |
| 2016 | 2 | 6 |
| 2017 | 6 | 4 |
| 2018 | 4 | 7 |
| 2019 | 11 | 9 |
| 2020 | 9 | 13 |
| 2021 | 13 | 8 |
| 2022 | 4 | 13 |
| 2023 | 8 | 9 |
| 2024 | 7 | 6 |
| 2025 | 7 | 16 |
| 2026 | 4 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mating backplane for high speed, high density electrical connector25 Aug 2026US 12,720,680 B2Amphenol Corporation
- Printed wiring board19 May 2026US 12,635,065 B2Sumitomo Electric Industries, Ltd.
- Circuit board and electronic device comprising same24 Feb 2026US 12,563,660 B2Samsung Electronics Co., Ltd.
- Capacitor in a substrate via6 Jan 2026US 12,520,426 B2Intel Corporation
- Circuit board device and its circuit module14 Oct 2025US 12,446,145 B2Global Unichip Corporation
- Printed wiring board1 Oct 2026US 2026/0304599 A1Sumitomo Electric Industries, Ltd.
- Circuit board device24 Sep 2026US 2026/0292971 A1Global Unichip Corporation
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Electronic module and electronic device6 Aug 2026US 2026/0231320 A1Canon Kabushiki Kaisha
- Substrate structure2 Jul 2026US 2026/0190227 A1Unimicron Technology Corp.
Most cited
By later US patents
- Coaxial vias in an electronic substrate144US 5,541,567 AInternational Business Machines Corporation · 1996
- Passive transmission line equalization using circuit-board thru-holes81US 6,812,803 B2Force10 Networks, Inc. · 2004
- High-speed router with single backplane distributing both power and signaling59US 6,988,162 B2Force10 Networks, Inc. · 2006
- Semiconductor package substrate59US 7,732,913 B2Siliconware Precision Industries Co., Ltd. · 2010
- Inductance-tuned circuit board via crosstalk structures52US 7,897,880 B1Force 10 Networks, Inc. · 2011