US 12,446,145 B2Granted

Circuit board device and its circuit module

AssigneesGlobal Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.

InventorsHuan-Yi Liao, Sheng-Fan Yang, Chi-Lou Yeh, Zhong-Yan You

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Abstract

A circuit board device includes a multilayer board structure, a main ground and a circuit module. The main ground is configured in the multilayer board structure. The circuit module includes two differential-signal portions. These differential-signal portions are all located on one core layer of the multilayer board structure. Each of the differential-signal portions includes a differential through-hole pair and a plurality of ground through holes, and these ground through holes are arranged at intervals to surround the differential through-hole pair, and are electrically connected to the main ground. The patterns of the differential-signal portions are mirror symmetrical to each other based on an imaginary mirror line therebetween, and the minimum linear distances from the differential-signal portions to the imaginary mirror line are equal to each other.

Claims16

Dependent claims

A circuit board device, comprising:

a multilayer board structure comprising a plurality of sheet layers and a core layer sandwiched between the sheet layers, wherein a thickness of the core layer is greater than a thickness of each of the sheet layers;
a main ground disposed in the multilayer board structure;
and
a circuit module comprising:
a first differential-signal portion disposed on the core layer, and comprising a first differential through-hole pair and a plurality of first ground through holes arranged at intervals to surround the first differential through-hole pair, and electrically connected to the main ground;
and
a second differential-signal portion disposed on the core layer, and comprising a second differential through-hole pair and a plurality of second ground through holes arranged at intervals to surround the second differential through-hole pair, and electrically connected to the main ground,
wherein a pattern of the second differential-signal portion and a pattern of the first differential-signal portion are mirror symmetrical to each other based on an imaginary mirror line between the second differential-signal portion and the first differential-signal portion, and a minimum linear distance between the first differential-signal portion and the imaginary mirror line and a minimum linear distance between the second differential-signal portion and the imaginary mirror line are equal to each other.

5 more elements

A circuit module disposed on a core layer of a multilayer board structure, comprising:

a first differential-signal portion comprising a first positive-signal channel, a first negative-signal channel and a plurality of first ground through holes, the first positive-signal channel and the first negative-signal channel which are arranged sequentially in a first axis direction, and a first channel spacing that is defined between the first positive-signal channel and the first negative-signal channel, and the first ground through holes are arranged at intervals to surround the first positive-signal channel and the first negative-signal channel, wherein a first hole spacing is defined between the first positive-signal channel and one of the first ground through holes closer to the first positive-signal channel, and the first positive-signal channel is not less than the first channel spacing, and is not greater than twice the first channel spacing, the first positive-signal channel and the one of the first ground through holes are arranged sequentially in a second axis direction that is intersected with the first axis direction and has a first included angle with the first axis direction, a second hole spacing being equal to the first hole spacing is defined between the first negative-signal channel and one of the first ground through holes closer to the first negative-signal channel, and the first negative-signal channel and the one of the first ground through holes are arranged sequentially in a third axis direction that is intersected with the first axis direction and has a second included angle with the first axis direction, and the second included angle is equal to the first included angle;
and
a second differential-signal portion, wherein a pattern of the second differential-signal portion and a pattern of the first differential-signal portion are mirror symmetrical to each other based on an imaginary mirror line between the second differential-signal portion and the first differential-signal portion.

Dependencies are inferred from the claim text.

Facts

Application: 18/542,773Filed 18 Dec 2023
Priority: TW 11213736228 Sep 2023
Published: US 2025/0113432 A13 Apr 2025
Granted: 14 Oct 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H05K 1/0224
By printed shielding conductors, ground planes or power plane: patterned shielding planes, ground planes or power planes
H05K 1/0245
High frequency adaptations: lay-out of balanced signal pairs, e.g. differential lines or twisted lines
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections

Family

US 2025/0113432 A1Pre-grant publication · published 3 Apr 2025
US 12,446,145 B2This patent

From the US filing history. Foreign family members aren’t listed.

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