Coaxial vias in an electronic substrate

A structure comprising:

• a plate of material, said plate has a plurality of through-holes extending therethrough;
• said through-holes have sidewalls;
• a first layer of electrically conductive material covering said sidewalls and electrically connecting said first layer of electrically conductive material in at least one of said through-holes to another said through-hole;
• an electrically insulating layer of a first dielectric material covering said first layer of electrically conductive material in said through hole, said first dielectric layer defines an opening which is substantially filled with a solid electrical conductor;
• a second layer of electrically conductive material electrically connecting at least one of said solid electrically conductive material in said through-hole to one other.

A plate of material having a plurality of through-holes extending therethrough;

• a first substrate having a first surface with a first pattern of electrical conductor thereon and a second surface with a second pattern of electrical conductor thereon;
• a second substrate having a third surface with a third pattern of electrically conductive material thereon and a fourth surface having a fourth pattern of electrically conductive material thereon;
• said plate is disposed between said first substrate and said second substrate;
• a plurality of solid electrical conductors extending through and substantially filling said through holes, providing electrical interconnection between, and terminating at, said first and second patterns, and between and at said third and said fourth patterns of electrical conductors.

A structure comprising:

• a substrate having a first side and a second side;
• a first dielectric layer disposed on said first side;
• a second dielectric layer disposed on said second side;
• an embedded region of electrically insulating material embedded within at least one of said first dielectric layer and said second dielectric layer;
• a first pattern of electrical conductors disposed on said first side;
• and
• a second pattern of electrical conductors disposed on said second side.

A structure comprising:

• a plate of material having a through-hole therethrough;
• said plate of material has a first surface and a second surface;
• said first surface has a first pattern of electrical conductors disposed thereon;
• said second surface has a second pattern of electrical conductors disposed thereon;
• said through-hole has a plurality of solid electrical conductors disposed therein electrically interconnecting said first and second patterns of electrical conductors and terminating thereat.

A structure comprising:

• a substrate having a first surface and a second surface;
• a first dielectric layer being disposed on said first surface and a second dielectric layer being disposed on said second surface;
• a region of electrically insulating material embedded within at least one of said dielectric layers;
• a first pattern of electrically conductive material disposed on said first dielectric layer;
• and
• a second pattern of electrically conductive material disposed on said second dielectric layer.

A structure comprising:

• a plate of substantially electrically nonconducting material having a through-hole;
• said plate has a first surface with a first pattern of electrically conductive material disposed thereon;
• said plate has a second surface with a second pattern of electrically conductive material disposed thereon;
• a solid electrical connector substantially filling said through-hole and extending between said first and second patterns;
• said solid electrical conductor has a first and a second end;
• said first end has a protuberance thereat wherein said protuberance is an enlargement of said solid electrical conductor;
• said protuberance is electrically connected to said first pattern of electrically conductive material;
• and said enlargement is selected from the group consisting of a ball bond and an ultrasonic bond.

A structure comprising:

• a plate of substantially electrically nonconducting material having a through-hole;
• said plate has a first surface with a first pattern of electrically conductive material disposed thereon;
• said plate has a second surface with a second pattern of electrically conductive material disposed thereon;
• a solid electrical connector substantially filling said through-hole and extending between said first and said second patterns;
• said solid electrical conductor has a first and a second end;
• said first end has a protuberance thereat;
• said protuberance is electrically connected to said first pattern of electrically conductive material;
• and
• said protuberance is an electrically conductive bonding material.

A structure comprising:

• a layer of magnetic material;
• said layer of magnetic material has a first surface with a first dielectric coating thereon and a second surface with a second dielectric coating thereon;
• said coated layer of magnetic material has a through-hole therethrough;
• said through-hole has a sidewall;
• said sidewall has a layer of nonmagnetic electrically conductive material disposed thereon;
• said layer of nonmagnetic electrically conductive material has a dielectric layer disposed thereon defining an opening;
• said opening is substantially filled with a solid nonmagnetic electrical conductor;
• said first dielectric coating has a first pattern of nonmagnetic electrically conductive material disposed thereon;
• and said second dielectric coating has a second pattern of nonmagnetic electrically conductive material disposed thereon;
• said nonmagnetic electrically conductive material disposed on said sidewall connects said first and said second patterns;
• said first pattern of nonmagnetic electrically conductive material has a third dielectric coating disposed thereon;
• and said second pattern of nonmagnetic electrically conductive material has a fourth dielectric coating disposed thereon;
• a third pattern of nonmagnetic electrically conductive material is disposed over said third dielectric coating;
• and a fourth pattern of nonmagnetic electrically conductive material is disposed over said fourth dielectric coating;
• said solid electrical conductor electrically connects said third and said fourth patterns and terminates thereat;
• at least one of said third and said fourth patterns further including an additional dielectric coating disposed thereon.

A structure comprising:

• a plate of material having a through hole;
• said plate has a first side with a first layer of conductive material disposed thereon;
• said plate has a second side with a second layer of conductive material disposed thereon;
• a solid electrical conductor is disposed in and substantially fills said through hole;
• said solid electrical conductor has a first end and a second end;
• said first end has a protuberance thereat selected from the group consisting of a ball bond and an ultrasonic bond;
• said protuberance is an enlargement of said solid electrical conductor;
• said protuberance is embedded in and electrically connected to said first layer of electrically conductive material.