H05K 2201/09581
Applying an insulating coating on the walls of holes
H05K2201/09581 (Applying an insulating coating on the walls of holes) appears on 185 US grants and 126 published applications in this corpus.
Search patents in H05K- Granted patents
- 185
- Published applications
- 126
- Assignees
- 102
- Inventors
- 470
- Latest grant
- 14 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 5 |
| 2002 | 6 | 5 |
| 2003 | 5 | 5 |
| 2004 | 6 | 8 |
| 2005 | 3 | 8 |
| 2006 | 8 | 6 |
| 2007 | 6 | 7 |
| 2008 | 4 | 3 |
| 2009 | 1 | 7 |
| 2010 | 8 | 9 |
| 2011 | 4 | 9 |
| 2012 | 7 | 5 |
| 2013 | 3 | 4 |
| 2014 | 4 | 2 |
| 2015 | 0 | 3 |
| 2016 | 5 | 8 |
| 2017 | 1 | 0 |
| 2018 | 4 | 6 |
| 2019 | 5 | 4 |
| 2020 | 7 | 6 |
| 2021 | 4 | 2 |
| 2022 | 4 | 3 |
| 2023 | 0 | 2 |
| 2024 | 1 | 2 |
| 2025 | 3 | 5 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Through-hole electrode substrate3 Sep 2024US 12,080,637 B2Dai Nippon Printing Co.Ltd.
- Glass wiring board, method for manufacturing the same, and semiconductor device2 Aug 2022US 11,406,025 B2Toppan Printing Co., Ltd.
- Bottom-up plating of through-glass vias18 Jun 2026US 2026/0173267 A1Intel Corporation
- Printed circuit board5 Mar 2026US 2026/0068048 A1Samsung Electro-Mechanics Co., Ltd.
- Component Carrier With Constricted Through Hole and Electrically Insulating Coating21 Aug 2025US 2025/0267795 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Glass circuit board and manufacturing method thereof and imaging device7 Aug 2025US 2025/0254790 A1Sony Semiconductor Solutions Corporation
- Circuit substrate and method for fabricating the same31 Jul 2025US 2025/0247957 A1Industrial Technology Research Institute
Most cited
By later US patents
- Method of making mechanical-laser structure126US 6,353,999 B1Unimicron Taiwan Corp. · 2002
- Lamination method for coating the sidewall or filling a cavity in a substrate107US 5,208,068 AInternational Business Machines Corporation · 1993
- Integrated circuit packaging using flexible substrate87US 5,065,227 AInternational Business Machines Corporation · 1991
- High k dielectric capacitor with low k sheathed signal vias83US 6,072,690 AInternational Business Machines Corporation · 2000
- Method for fabricating a stack of two dimensional circuit modules80US 5,657,537 AGeneral Electric Company · 1997