Method of making mechanical-laser structure
AssigneeUnimicron Taiwan Corp.
InventorDavid C. H. Cheng
Life of this patent
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Abstract
A mechanical-laser structure on a printed circuit board and a carrier. A method for fabricating the mechanical-laser structure includes the following steps. A substrate is provided. A first through hole is formed in the substrate by mechanical drilling. An epoxy plug is formed within the first through hole. A conductive layer is formed on the substrate by compression. The conductive layer is patterned to form conducting wires and exposes the epoxy plug. A micro via is formed within the epoxy plug by laser drilling.
Claims8
A method for fabricating a mechanical-laser structure on a printed circuit board and a carrier, the method comprising:
- providing a substrate;
- forming a first through hole in the substrate by mechanical drilling;
- filling epoxy resin within the first through hole to form a plug;
- forming a first conductive layer on the substrate and the plug;
- patterning the first conductive layer to form conducting wires, wherein the plug is exposed;
- and
- forming a second through hole within the plug by laser ablating, wherein a diameter of the second through hole is smaller than the first through hole.
Dependencies are inferred from the claim text.