Wiring board
AssigneeKYOCERA Corporation
InventorHidetoshi Yugawa
Life of this patent
Estimating the term…
Abstract
A wiring board according to the present disclosure includes a first insulation layer including a first surface, a land located on the first insulation layer and including a second surface, a second insulation layer located at the first surface of the first insulation layer and including a via hole extending over the second surface of the land, and a via-hole electrical conductor located in the via hole. The land includes a plurality of recessed portions on the second surface, and at least one recessed portion selected from the plurality of recessed portions includes a buffer body containing resin. The via-hole electrical conductor is in contact with the second surface of the land and the buffer body.
Claims8
A wiring board comprising:
- a first insulation layer comprising a first surface;
- a land located on the first insulation layer and comprising a second surface;
- a second insulation layer located at the first surface of the first insulation layer and comprising a via hole extending over the second surface of the land;
- and
- a via-hole electrical conductor located in the via hole, wherein
- the land comprises a plurality of recessed portions on the second surface, and
- a buffer body located entirely within a respective recessed portion selected from the plurality of recessed portions, wherein the buffer body is formed from a resin and is located between the via-hole electrical conductor and the second surface of the land, and
- the via-hole electrical conductor is in contact with the second surface of the land and the buffer body.
Dependencies are inferred from the claim text.