Electronic component and manufacturing method thereof

A manufacturing method of an electronic component, comprising:

• preparing a motherboard composed of photosensitive glass and including a first principal surface and a second principal surface;
• irradiating a cutting region of the first principal surface with ultraviolet light and subsequently crystallizing the motherboard by heating to form a crystallized portion extending from the first principal surface to the second principal surface in a direction parallel to the first principal surface;
• causing a part of the crystallized portion to remain in the cutting region while removing another part of the crystallized portion by etching to form a groove extending in a direction parallel to the first principal surface;
• forming a through-conductor extending through the first principal surface and the second principal surface of the motherboard;
• embedding a colored insulation layer within the groove and bringing the colored insulation layer into contact with the crystallized portion;
• and
• splitting the motherboard into a plurality of electronic components by cutting the colored insulation layer and the crystallized portion along the cutting region.