H01J 37/3408
Planar magnetron sputtering
Official title: {Planar magnetron sputtering}
H01J37/3408 (Planar magnetron sputtering) appears on 665 US grants and 591 published applications in this corpus.
Search patents in H01J- Granted patents
- 665
- Published applications
- 591
- Assignees
- 269
- Inventors
- 1,339
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 7 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 13 | 0 |
| 1984 | 18 | 0 |
| 1985 | 9 | 0 |
| 1986 | 15 | 0 |
| 1987 | 6 | 0 |
| 1988 | 10 | 0 |
| 1989 | 12 | 0 |
| 1990 | 5 | 0 |
| 1991 | 8 | 0 |
| 1992 | 11 | 0 |
| 1993 | 14 | 0 |
| 1994 | 12 | 0 |
| 1995 | 12 | 0 |
| 1996 | 15 | 0 |
| 1997 | 16 | 0 |
| 1998 | 14 | 0 |
| 1999 | 20 | 0 |
| 2000 | 20 | 0 |
| 2001 | 28 | 9 |
| 2002 | 31 | 17 |
| 2003 | 13 | 28 |
| 2004 | 27 | 34 |
| 2005 | 12 | 32 |
| 2006 | 11 | 39 |
| 2007 | 12 | 48 |
| 2008 | 8 | 36 |
| 2009 | 14 | 33 |
| 2010 | 19 | 44 |
| 2011 | 12 | 36 |
| 2012 | 16 | 24 |
| 2013 | 24 | 22 |
| 2014 | 29 | 32 |
| 2015 | 16 | 15 |
| 2016 | 19 | 19 |
| 2017 | 17 | 19 |
| 2018 | 14 | 17 |
| 2019 | 9 | 14 |
| 2020 | 14 | 8 |
| 2021 | 8 | 15 |
| 2022 | 19 | 14 |
| 2023 | 17 | 19 |
| 2024 | 7 | 7 |
| 2025 | 12 | 3 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Permeance magnetic assembly15 Sep 2026US 12,738,468 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same7 Apr 2026US 12,597,902 B2Qorvo US, Inc.
- Sputtering apparatus17 Mar 2026US 12,580,168 B2Canon Anelva Corporation
- Physical vapor deposition apparatus10 Feb 2026US 12,548,746 B2Samsung Electronics Co., Ltd.
- Physical vapor deposition source and chamber assembly16 Sep 2025US 12,417,903 B2APPLIED Materials.Inc.
- Sputtering apparatus24 Sep 2026US 2026/0290772 A1Tokyo Electron Limited
- Semiconductor process chamber and semiconductor process equipment30 Jul 2026US 2026/0218372 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Apparatus For Depositing Material Layers on a Substrate23 Jul 2026US 2026/0209932 A1
- Physical vapor deposition apparatus14 May 2026US 2026/0135070 A1Samsung Electronics Co., Ltd.
- Scanning Magnetron Device and Magnetron Sputtering Apparatus for PVD Planar Target23 Apr 2026US 2026/0112591 A1Arrayed Materials (China) Co., Ltd.
Most cited
By later US patents
- Inductive plasma loop enhancing magnetron sputtering272US 6,679,981 B1APPLIED Materials.Inc. · 2004
- Sputtering process and apparatus180US 4,166,018 AAirco, Inc. · 1979
- Sputter coating process control method and apparatus156US 5,126,028 AMaterials Research Corporation · 1992
- Cathode arrangement for sputtering material from a target in a cathode sputtering unit142US 4,448,653 ABalzers Aktiengesellschaft · 1984
- Piezoelectric shear wave resonator and method of making same135US 4,719,383 AThe United States of America as represented by the United States Department of Energy · 1988