Cathode arrangement for sputtering material from a target in a cathode sputtering unit
AssigneeBalzers Aktiengesellschaft
InventorUrs Wegmann
Life of this patent
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Abstract
A cathode arrangement for sputtering material from a target in a cathode sputtering unit comprises a frame-shape magnet disposed adjacent the target and remote from the surface to be sputtered and another magnet located within the frame-shape magnet. The directions of magnetization of the two magnets form an angle of from 45 to 90 degrees. The frame-shape magnet is made of a permanent magnet material having an energy density of at least 40 kJ per m.sup.3. The other magnet is made of a permanent magnet material having an energy density of less than 40 kJ per m.sup.3.
Claims10
A cathode arrangement for sputtering material from a target in a cathode sputtering unit, comprising a frame-shape magnet being disposed adjacent the target remote from the surface to be sputtered, and another magnet being provided within said frame-shap magnet, and with the directions of magnetization of the two magnets forming an angle of between 45.degree. and 90.degree., said frame-shape magnet being made of a permanent-magnet mterial having an energy density of at least 40 kJ per m.sup.3 and the other magnet being made of a permanent-magnet material having an energy density of less than 40 kJ per m.sup.3.
Dependencies are inferred from the claim text.