H01J 37/32697
Electrostatic control
Official title: {Electrostatic control}
H01J37/32697 (Electrostatic control) appears on 862 US grants and 1,068 published applications in this corpus.
Search patents in H01J- Granted patents
- 862
- Published applications
- 1,068
- Assignees
- 216
- Inventors
- 2,059
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 7 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 12 | 0 |
| 1997 | 12 | 0 |
| 1998 | 9 | 0 |
| 1999 | 13 | 0 |
| 2000 | 22 | 0 |
| 2001 | 22 | 14 |
| 2002 | 29 | 27 |
| 2003 | 20 | 19 |
| 2004 | 15 | 22 |
| 2005 | 18 | 23 |
| 2006 | 7 | 38 |
| 2007 | 11 | 31 |
| 2008 | 10 | 42 |
| 2009 | 11 | 33 |
| 2010 | 23 | 23 |
| 2011 | 19 | 21 |
| 2012 | 20 | 20 |
| 2013 | 25 | 34 |
| 2014 | 22 | 41 |
| 2015 | 21 | 40 |
| 2016 | 27 | 40 |
| 2017 | 30 | 56 |
| 2018 | 37 | 52 |
| 2019 | 36 | 51 |
| 2020 | 46 | 55 |
| 2021 | 40 | 58 |
| 2022 | 50 | 59 |
| 2023 | 50 | 71 |
| 2024 | 69 | 55 |
| 2025 | 48 | 92 |
| 2026 | 32 | 51 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Integrated control of a plasma processing system22 Sep 2026US 12,744,184 B2Advanced Energy Industries, Inc.
- Apparatus for treating substrate and method for treating substrate1 Sep 2026US 12,725,765 B2Psk Inc.
- Substrate processing device25 Aug 2026US 12,719,028 B2Semes Co., Ltd.
- Substrate processing apparatus25 Aug 2026US 12,719,029 B2Samsung Electronics Co., Ltd.
- Plasma processing method and plasma processing apparatus25 Aug 2026US 12,719,032 B2Tokyo Electron Limited
- Wafer placement table8 Oct 2026US 2026/0311975 A1NGK Corporation
- Substrate support and substrate processing apparatus1 Oct 2026US 2026/0302141 A1Tokyo Electron Limited
- Tunable edge sheath with nanosecond rf pulses10 Sep 2026US 2026/0269195 A1Lam Research Corporation
- Transformer isolator having rf shield structure for effective magnetic power transfer27 Aug 2026US 2026/0253794 A1Lam Research Corporation
- Arc-resistant electrostatic chucks and arc-reducing plugs for electrostatic chucks20 Aug 2026US 2026/0245837 A1Lam Research Corporation
Most cited
By later US patents
- Vacuum processing chamber having multi-mode access485US 6,095,083 AApplied Materiels, Inc. · 2000
- Plasma processing apparatus and method485US 7,951,262 B2Tokyo Electron Limited · 2011
- Plasma processing apparatus and plasma processing method482US 7,736,528 B2Panasonic Corporation · 2010
- Design of gas injection for the electrode in a capacitively coupled RF plasma reactor476US 6,502,530 B1Unaxis Balzers Aktiengesellschaft · 2003
- High-density plasma etching of carbon-based low-k materials in a integrated circuit458US 6,284,149 B1APPLIED Materials.Inc. · 2001