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US 12,719,028 B2Granted
Substrate processing device
AssigneeSemes Co., Ltd.
InventorsHyoungkyu Son, Jaewoong Sim, Donguk Kim, Yunsang Kim, Inhoe Kim
Life of this patent
Estimating the term…
Abstract
A substrate processing device is provided. The substrate processing device includes: a substrate supporter configured to support a substrate; a heating ring horizontally surrounding the substrate supporter; and an edge ring horizontally surrounding the heating ring and configured to cover a top surface of the heating ring.
Claims19
A substrate processing device comprising:
- a substrate supporter configured to support a substrate;
- a heating ring horizontally surrounding the substrate supporter;
- a cooling ring horizontally surrounding the heating ring;
- and
- an edge ring horizontally surrounding the heating ring,
- wherein the edge ring is configured to cover top surfaces of the heating ring and the cooling ring,
- wherein the edge ring includes a first surface, which is a top surface of a portion covering the heating ring, and a second surface, which is a top surface of a portion covering the cooling ring, and
- wherein the second surface is positioned at a vertically higher level than the first surface.
5 more elements
A substrate processing device comprising:
- a substrate supporter configured to support a substrate;
- a heating ring horizontally surrounding the substrate supporter;
- a cooling ring horizontally surrounding the heating ring;
- and
- an edge ring horizontally surrounding the heating ring,
- wherein the edge ring is configured to cover top surfaces of the heating ring and the cooling ring,
- wherein the edge ring includes a first surface, which is a top surface of a portion covering the heating ring, and a second surface, which is a top surface of a portion covering the cooling ring, and
- wherein the second surface is positioned at a vertically higher level than the first surface,
- wherein the first surface is positioned at a lower vertical level than a top surface of the substrate supporter, such that a gap is formed between the first surface and the substrate.
6 more elements
A substrate processing device comprising:
- a substrate supporter comprising a support puck configured to support a substrate on a top surface thereof by generating an electrostatic tensile force and a chuck body arranged on a bottom surface of the support puck and configured to cool the support puck;
- a heating ring horizontally surrounding the substrate supporter;
- a cooling ring horizontally surrounding the heating ring;
- a base plate arranged on bottom surfaces of the substrate supporter, the heating ring, and the cooling ring and configured to receive radio frequency (RF) power;
- and
- an edge ring horizontally surrounding the cooling ring and the base plate and configured to cover top surfaces of the heating ring and the cooling ring,
- wherein the edge ring includes a first surface, which is a top surface of a portion covering the heating ring, and a second surface, which is a top surface of a portion covering the cooling ring, and
- wherein the second surface is positioned at a vertically higher level than the first surface.
5 more elements
Dependencies are inferred from the claim text.