H01J 37/32522
Temperature
Official title: {Temperature}
H01J37/32522 (Temperature) appears on 668 US grants and 995 published applications in this corpus.
Search patents in H01J- Granted patents
- 668
- Published applications
- 995
- Assignees
- 199
- Inventors
- 2,293
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 12 | 0 |
| 2000 | 25 | 0 |
| 2001 | 19 | 5 |
| 2002 | 24 | 29 |
| 2003 | 17 | 14 |
| 2004 | 17 | 17 |
| 2005 | 8 | 36 |
| 2006 | 11 | 24 |
| 2007 | 6 | 23 |
| 2008 | 11 | 14 |
| 2009 | 5 | 17 |
| 2010 | 12 | 19 |
| 2011 | 9 | 13 |
| 2012 | 5 | 21 |
| 2013 | 13 | 18 |
| 2014 | 12 | 27 |
| 2015 | 22 | 56 |
| 2016 | 18 | 36 |
| 2017 | 21 | 37 |
| 2018 | 30 | 39 |
| 2019 | 29 | 60 |
| 2020 | 48 | 49 |
| 2021 | 40 | 51 |
| 2022 | 38 | 65 |
| 2023 | 30 | 89 |
| 2024 | 55 | 75 |
| 2025 | 69 | 99 |
| 2026 | 38 | 62 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Remote plasma apparatus for generating high-power density microwave plasma15 Sep 2026US 12,738,457 B2APPLIED Materials.Inc.
- Plasma processing system, assistance device, assistance method, and assistance program8 Sep 2026US 12,731,763 B2Tokyo Electron Limited
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- Window edge heater for high power plasma processing applications1 Sep 2026US 12,725,759 B2Lam Research Corporation
- In-situ carbon liner for high aspect ratio features1 Sep 2026US 12,727,409 B2APPLIED Materials.Inc.
- Shower head and plasma processing apparatus including the same and method of manufacturing a semiconductor device1 Oct 2026US 2026/0302138 A1Samsung Electronics Co., Ltd.
- Method and device for plasma heating of the internal walls of a vacuum furnace1 Oct 2026US 2026/0302140 A1
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Methods and systems for cooling plasma treatment components17 Sep 2026US 2026/0279735 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma processing apparatus17 Sep 2026US 2026/0279738 A1Tokyo Electron Limited
Most cited
By later US patents
- Process feed management for semiconductor substrate processing741US 9,017,481 B1ASM America, Inc. · 2015
- Temperature control system for semiconductor process chamber652US 6,015,465 AAPPLIED Materials.Inc. · 2000
- Surface-treated shower head for use in a substrate processing chamber584US 6,182,603 B2Applied Komatsu Technology, Inc. · 2001
- Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system572US 6,635,117 B1Axcelis Technologies, Inc. · 2003
- Showerhead electrode assembly for plasma processing apparatuses561US 7,645,341 B2Lam Research Corporation · 2010