H01J 37/32504
Means for preventing sputtering of the vessel
Official title: {Means for preventing sputtering of the vessel}
H01J37/32504 (Means for preventing sputtering of the vessel) appears on 58 US grants and 90 published applications in this corpus.
Search patents in H01J- Granted patents
- 58
- Published applications
- 90
- Assignees
- 30
- Inventors
- 261
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 2 |
| 2002 | 0 | 4 |
| 2003 | 0 | 3 |
| 2004 | 2 | 3 |
| 2005 | 0 | 3 |
| 2006 | 0 | 2 |
| 2007 | 1 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 1 | 2 |
| 2012 | 1 | 3 |
| 2013 | 0 | 5 |
| 2014 | 3 | 2 |
| 2015 | 3 | 1 |
| 2016 | 1 | 5 |
| 2017 | 3 | 5 |
| 2018 | 2 | 4 |
| 2019 | 1 | 5 |
| 2020 | 5 | 7 |
| 2021 | 1 | 10 |
| 2022 | 3 | 6 |
| 2023 | 3 | 2 |
| 2024 | 11 | 3 |
| 2025 | 4 | 2 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor manufacturing apparatus and component for semiconductor manufacturing apparatus18 Aug 2026US 12,712,157 B2Tokyo Electron Limited
- Minimization of ring erosion during plasma processes28 Apr 2026US 12,614,700 B2APPLIED Materials.Inc.
- Substrate processing apparatus and method of manufacturing semiconductor device29 Jul 2025US 12,374,527 B2Kokusai Electric Corporation
- Texturizing a surface without bead blasting3 Jun 2025US 12,318,868 B2APPLIED Materials.Inc.
- Apparatus for preventing contamination of self-plasma chamber20 May 2025US 12,308,217 B2Nanotech Inc.
- Components and processes for managing plasma process byproduct materials23 Jul 2026US 2026/0213142 A1Lam Research Corporation
- Etching method and plasma processing apparatus4 Jun 2026US 2026/0155338 A1Tokyo Electron Limited
- Substrate processing apparatus and method of manufacturing semiconductor device30 Oct 2025US 2025/0336646 A1Kokusai Electric Corporation
- Coatings on inner surfaces of particle containment chambers19 Jun 2025US 2025/0201529 A1Helion Energy, Inc.
- Apparatus for preventing contamination of self-plasma chamber1 Aug 2024US 2024/0258077 A1Nanotech Inc.
Most cited
By later US patents
- Semiconductor processing apparatus which is formed from yttrium oxide and zirconium oxide to produce a solid solution ceramic apparatus88US 8,034,734 B2APPLIED Materials.Inc. · 2011
- Plasma source pumping and gas injection baffle74US 8,747,610 B2Tokyo Electron Limited · 2014
- Thin film deposition system66US 5,135,629 ANippon Mining Co., Ltd. · 1992
- Electrically floating shield in a plasma reactor50US 5,736,021 AAPPLIED Materials.Inc. · 1998
- Plasma processing apparatus and plasma processing method35US 6,171,438 B2Hitachi, Ltd. · 2001