Semiconductor manufacturing apparatus and component for semiconductor manufacturing apparatus
AssigneeTokyo Electron Limited
InventorNaoyuki Satoh
Life of this patent
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Abstract
Provided is a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes: a processing chamber; a substrate support provided in the processing chamber and configured to hold a substrate; a plate facing the substrate support and having a gas introduction port; and a cylindrical member configured to support the plate and surround a periphery of the substrate. The plate and the cylindrical member constitute a component of a SiC member having a SiC film deposited by CVD, and the cylindrical member includes a first portion that is deformable under a load.
Claims20
A semiconductor manufacturing apparatus comprising:
- a processing chamber;
- a substrate support provided in the processing chamber and configured to hold a substrate;
- a plate facing the substrate support and having a gas introduction port;
- and
- a cylindrical member configured to support the plate and surround a periphery of the substrate, wherein
- the plate and the cylindrical member constitute a component of a SiC member having a SiC film deposited by CVD, and
- the cylindrical member includes a first portion that is deformable under a load.
A plasma processing apparatus comprising:
- a plasma processing chamber;
- a substrate support disposed in the plasma processing chamber;
- and
- a SiC member disposed in the plasma processing chamber,
- wherein the SiC member comprises:
- a shower plate portion disposed above the substrate support;
- and
- a cylindrical portion surrounding the substrate support,
- wherein the cylindrical portion has a hollow structure and is deformable under a load.
A substrate processing apparatus comprising:
- a chamber;
- a substrate support disposed in the chamber;
- and
- a member disposed in the chamber,
- wherein the member comprises:
- a shower plate portion disposed above the substrate support;
- and
- a cylindrical portion surrounding the substrate support, and
- wherein the cylindrical portion has a hollow structure and is deformable under a load.
Dependencies are inferred from the claim text.