H01J 37/32357
Generation remote from the workpiece
Official title: {Generation remote from the workpiece, e.g. down-stream}
H01J37/32357 (Generation remote from the workpiece) appears on 1,398 US grants and 2,002 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,398
- Published applications
- 2,002
- Assignees
- 425
- Inventors
- 3,734
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 8 | 0 |
| 1991 | 14 | 0 |
| 1992 | 10 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 10 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 11 | 0 |
| 1999 | 15 | 0 |
| 2000 | 17 | 0 |
| 2001 | 25 | 13 |
| 2002 | 24 | 32 |
| 2003 | 22 | 25 |
| 2004 | 23 | 42 |
| 2005 | 20 | 43 |
| 2006 | 12 | 51 |
| 2007 | 19 | 52 |
| 2008 | 20 | 45 |
| 2009 | 22 | 57 |
| 2010 | 19 | 52 |
| 2011 | 32 | 50 |
| 2012 | 25 | 54 |
| 2013 | 35 | 52 |
| 2014 | 45 | 103 |
| 2015 | 74 | 135 |
| 2016 | 100 | 126 |
| 2017 | 76 | 111 |
| 2018 | 69 | 96 |
| 2019 | 88 | 89 |
| 2020 | 81 | 100 |
| 2021 | 74 | 98 |
| 2022 | 65 | 113 |
| 2023 | 65 | 138 |
| 2024 | 71 | 129 |
| 2025 | 78 | 109 |
| 2026 | 62 | 87 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Remote plasma deposition with electrostatic clamping6 Oct 2026US 12,757,682 B2Lam Research Corporation
- Advanced OES characterization29 Sep 2026US 12,749,664 B2Tokyo Electron Limited
- Selective deposition using graphene as an inhibitor29 Sep 2026US 12,751,261 B2Lam Research Corporation
- Integrated control of a plasma processing system22 Sep 2026US 12,744,184 B2Advanced Energy Industries, Inc.
- Showerhead structure, and substrate processing chamber and semiconductor processing apparatus having the same8 Oct 2026US 2026/0311970 A1ASM IP Holding B. V.
- Integration of vapor deposition process into plasma etch reactor8 Oct 2026US 2026/0311972 A1Lam Research Corporation
- Apparatus and method for removal of oxide and carbon from semiconductor films in a single processing chamber8 Oct 2026US 2026/0314290 A1ASM IP Holding B. V.
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Plasma and Photon assisted Metal-Organic Chemical Vapor Deposition24 Sep 2026US 2026/0286510 A1PhantaField Inc.
Most cited
By later US patents
- Integration of remote plasma generator with semiconductor processing chamber865US 6,387,207 B1APPLIED Materials.Inc. · 2002
- Apparatus for treating the surface with neutral particle beams715US 6,935,269 B2Hag-Joo Lee · 2005
- Remote plasma source seasoning624US 7,989,365 B2APPLIED Materials.Inc. · 2011
- Method for improved remote microwave plasma source for use with substrate processing system621US 6,271,148 B1APPLIED Materials.Inc. · 2001
- Surface-treated shower head for use in a substrate processing chamber584US 6,182,603 B2Applied Komatsu Technology, Inc. · 2001