H01J 37/32266
Means for controlling power transmitted to the plasma
Official title: {Means for controlling power transmitted to the plasma}
H01J37/32266 (Means for controlling power transmitted to the plasma) appears on 210 US grants and 172 published applications in this corpus.
Search patents in H01J- Granted patents
- 210
- Published applications
- 172
- Assignees
- 97
- Inventors
- 493
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 8 | 0 |
| 1997 | 9 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 8 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 3 |
| 2003 | 5 | 4 |
| 2004 | 6 | 10 |
| 2005 | 2 | 2 |
| 2006 | 2 | 2 |
| 2007 | 4 | 4 |
| 2008 | 1 | 3 |
| 2009 | 4 | 1 |
| 2010 | 1 | 3 |
| 2011 | 3 | 5 |
| 2012 | 3 | 1 |
| 2013 | 0 | 8 |
| 2014 | 5 | 10 |
| 2015 | 3 | 9 |
| 2016 | 4 | 8 |
| 2017 | 8 | 8 |
| 2018 | 5 | 11 |
| 2019 | 9 | 8 |
| 2020 | 11 | 8 |
| 2021 | 7 | 17 |
| 2022 | 10 | 16 |
| 2023 | 9 | 8 |
| 2024 | 12 | 7 |
| 2025 | 12 | 10 |
| 2026 | 5 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Plasma processing apparatus6 Oct 2026US 12,755,940 B2Tokyo Electron Limited
- Modification method and modification device6 Oct 2026US 12,755,941 B2Tokyo Electron Limited
- Electromagnetic wave supply mechanism and plasma processing apparatus26 May 2026US 12,640,347 B2Tokyo Electron Limited
- Microwave system for microwave-assisted surface chemistry annealing of ALD processes utilizing microwave radiation energy19 May 2026US 12,630,922 B2MKS Inc.
- Substrate processing method7 Apr 2026US 12,595,563 B2Tokyo Electron Limited
- Microwave plasma cvd device27 Aug 2026US 2026/0253840 A1National Institute of Advanced Industrial Science and Technology
- A microwave plasma reactor with a plurality of emitters and absorbers and a method for plasma processing a workpiece using such a microwave plasma reactor18 Jun 2026US 2026/0171365 A1
- Plasma processing apparatus and plasma processing method11 Jun 2026US 2026/0162946 A1Hitachi High-Tech Corporation
- Electric field uniformity on distributed electrode26 Mar 2026US 2026/0088254 A1ASM IP Holding B. V.
- Power supply assembly for generating a plasma, and plasma process system19 Mar 2026US 2026/0081109 A1Trumpf HüTtinger GmbH + Co. KG
Most cited
By later US patents
- Plasma density controller for semiconductor device processing equipment484US 5,082,517 ATexas Instruments Incorporated · 1992
- Plasma deposited coatings, and low temperature plasma method of making same289US 4,737,379 AEnergy Conversion Devices, Inc. · 1988
- Plasma processing method and apparatus283US 6,158,383 AHitachi, Ltd. · 2000
- Method and apparatus for plasma treatment of a surface271US 5,645,645 ABoard of Trustees operating Michigan State University · 1997
- Plasma processing method256US 5,626,922 ASemiconductor Energy Laboratory Co.Ltd. · 1997